Footprints
719 footprints matching “thermal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm_ThermalVias
Package_SO
HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- —
Infineon_PG-DSO-12-11_ThermalVias
Package_SO
Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/)
- Pads
- 13
- SMD
- 12.1×8.6
- Boards
- —
Infineon_PG-DSO-20-30_ThermalVias
Package_SO
Infineon SO package 20pin, exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/)
- Pads
- 21
- SMD
- 12.0×13.3
- Boards
- —
Infineon_PG-DSO-20-85_ThermalVias
Package_SO
Infineon SO package 20pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/)
- Pads
- 21
- SMD
- 16.1×16.4
- Boards
- —
Infineon_PG-DSO-8-27_3.9x4.9mm_EP2.65x3mm_ThermalVias
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
Linear_HTSSOP-31-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias
Package_SO
Linear HTSSOP, 31 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)
- Pads
- 32
- SMD
- 7.1×10.2
- Boards
- —
MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm_ThermalVias
Package_SO
MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- —
MSOP-10-1EP_3x3mm_P0.5mm_EP2.2x3.1mm_Mask1.83x1.89mm_ThermalVias
Package_SO
MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27)
- Pads
- 11
- SMD
- 6.3×3.6
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm_ThermalVias
Package_SO
SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)
- Pads
- 21
- SMD
- 11.9×13.3
- Boards
- —
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm_ThermalVias
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008D_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.57x1.89mm_ThermalVias
Package_SO
Texas DGN0008D VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —