Footprints

7,757 footprints matching “pins”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

7,757 footprints · page 297 of 324

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MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)

Pads: 9
SMD: 6.3×3.5
Boards: —

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads: 29
SMD: 8.0×10.3
Boards: —

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads: 29
SMD: 8.0×10.3
Boards: —

OnSemi_751EP_SOIC-4_3.9x4.725mm_P2.54mm

FP—

Package_SO

OnSemi 751EP SOIC, 4 Pin (https://www.onsemi.com/pdf/datasheet/mb8s-d.pdf)

Pads: 4
SMD: 9.1×5.2
Boards: —

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads: 17
SMD: 7.3×5.4
Boards: —

Renesas_SOP-32_11.4x20.75mm_P1.27mm

FP—

Package_SO

Renesas SOP, 32 Pin (https://www.renesas.com/en/document/psc/package-drawing-sop-32pin-prsp0032df)

Pads: 32
SMD: 15.6×21.3
Boards: —

SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm_ThermalVias

FP—

Package_SO

SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)

Pads: 21
SMD: 11.9×13.3
Boards: —

SOIC-14-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)

Pads: 14
SMD: 7.4×10.4
Boards: —

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads: 5
SMD: 8.4×4.1
Boards: —

SOIC-8_3.81x9.347mm_P2.54mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc2014n-datasheet?assetguid=6e3baf84-de75-4ea7-97ce-3a5e05a007c9)

Pads: 8
SMD: 7.5×9.9
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: —