Footprints
310 footprints matching “8-pin”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 11
TerminalBlock_Phoenix_MPT-0,5-8-2.54_1x08_P2.54mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MPT-0,5-8-2.54, 8 pins, pitch 2.54mm, size 20.8x6.2mm, drill diameter 1.1mm, pad diameter 2.2mm, http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf
- Pads
- 8
- THT
- 21.8×7.2
- Boards
- 11
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.5mm
Package_DFN_QFN
DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 10
DFN-8-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf#page=10)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 10
JEITA_SOIC-8_3.9x4.9mm_P1.27mm
Package_SO
JEITA SOIC, 8 Pin (JEITA/EIAJ ED-7311-19, variation 08-001-ADB, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=20)
- Pads
- 8
- SMD
- 7.3×5.4
- Boards
- 10
SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
Package_SON
SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf)
- Pads
- 9
- SMD
- 3.6×2.5
- Boards
- 10
DFN-8-1EP_3x3mm_P0.65mm_EP1.7x2.05mm
Package_DFN_QFN
DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf)
- Pads
- 9
- SMD
- 4.2×3.5
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
Molex_PicoBlade_53048-0810_1x08_P1.25mm_Horizontal
Connector_Molex
Molex PicoBlade Connector System, 53048-0810, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf)
- Pads
- 8
- THT
- 12.8×6.5
- Boards
- 8
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.3mm
Package_DFN_QFN
DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 8
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- 8
SOIC-8_5.3x6.2mm_P1.27mm
Package_SO
SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)
- Pads
- 8
- SMD
- 9.4×6.7
- Boards
- 8
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm
Package_SO
SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 8
TerminalBlock_Phoenix_MKDS-1,5-8_1x08_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-8, 8 pins, pitch 5mm, size 40x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 8
- THT
- 41.0×10.8
- Boards
- 8
TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 8
- THT
- 29.0×8.6
- Boards
- 8
DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 7
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 7
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 7
TerminalBlock_TE_282834-8_1x08_P2.54mm_Horizontal
TerminalBlock_TE-Connectivity
Terminal Block TE 282834-8, 8 pins, pitch 2.54mm, size 20.8x6.5mm, drill diameter 1.1mm, pad diameter 2.1mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf
- Pads
- 8
- THT
- 21.8×7.5
- Boards
- 7
Molex_Micro-Fit_3.0_43045-1600_2x08_P3.00mm_Horizontal
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43045-1600 (alternative finishes: 43045-160x), 8 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf)
- Pads
- 16
- THT
- 29.2×13.7
- Boards
- 6
Molex_Micro-Fit_3.0_43045-1612_2x08_P3.00mm_Vertical
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43045-1612 (compatible alternatives: 43045-1613, 43045-1614), 8 Pins per row (http://www.molex.com/pdm_docs/sd/430450212_sd.pdf)
- Pads
- 16
- THT
- 29.2×9.8
- Boards
- 6