Footprints
69 footprints matching “Instruments”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 80
- SMD
- 6.0×6.0
- Boards
- —
Texas_PicoStar_BGA-4_0.758x0.758mm_Layout2x2_P0.4mm
Package_BGA
Texas Instruments PicoStar - 0.15 mm max height, 0.758x0.758mm, 4 Ball, 2x2 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/tmp114.pdf
- Pads
- 4
- SMD
- 2.8×2.8
- Boards
- —
Texas_YFP0020_DSBGA-20_1.588x1.988mm_Layout4x5_P0.4mm
Package_BGA
Texas Instruments, YFP0020, DSBGA-20, area grid, 1.588x1.988mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/txs0206.pdf
- Pads
- 20
- SMD
- 3.6×4.0
- Boards
- —
Texas_B3QFN-14-1EP_5x5.5mm_P0.65mm
Package_DFN_QFN
Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf
- Pads
- 15
- SMD
- 5.9×6.0
- Boards
- —
Texas_RDX0007A_QFN-FCMOD-7-3.3x4mm-P0.5mm_4EP
Package_DFN_QFN
surface-mount, Texas Instruments, power, DC/DC, https://www.ti.com/lit/ml/mpqf721/mpqf721.pdf
- Pads
- 7
- SMD
- 4.6×4.8
- Boards
- —
Texas_RNN0018A
Package_DFN_QFN
Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf)
- Pads
- 18
- SMD
- 4.4×4.4
- Boards
- —
Texas_RWH0032A
Package_DFN_QFN
Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf)
- Pads
- 33
- SMD
- 8.9×8.9
- Boards
- —
Texas_RWH0032A_ThermalVias
Package_DFN_QFN
Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf)
- Pads
- 33
- SMD
- 8.9×8.9
- Boards
- —
Texas_S-PWQFN-N20
Package_DFN_QFN
20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)
- Pads
- 20
- SMD
- 3.9×3.9
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm
Package_SO
TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- —
Texas_NDQ
Package_TO_SOT_SMD
Texas Instruments, NDQ, 5 pin (https://www.ti.com/lit/ml/mmsf022/mmsf022.pdf)
- Pads
- 6
- SMD
- 15.0×10.7
- Boards
- —
TO-220-9_P1.93x5.08mm_StaggerOdd_Lead3.378mm_Vertical
Package_TO_SOT_THT
TO-220-9, Vertical, RM 0.965mm, Texas_NEC0009A, Texas_TA09A-(Rev-C), staggered type-1, see Texas Instruments NEC0009A, https://www.ti.com/lit/ml/mpsf023/mpsf023.pdf?ts=1736330780857
- Pads
- 9
- THT
- 10.7×9.2
- Boards
- —