Footprints

2,819 footprints matching “LEAD”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,819 footprints · page 3 of 118

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DIP-32_W15.24mm

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 32
THT: 17.3×41.2
Boards: 82

DIP-24_W15.24mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 24
THT: 17.3×31.0
Boards: 80

DIP-28_W7.62mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 28
THT: 10.7×36.2
Boards: 75

DIP-32_W15.24mm_Socket

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 32
THT: 18.3×41.3
Boards: 75

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)

Pads: 33
SMD: 6.3×6.3
Boards: 72

WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm

FP3D

Package_SON

WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))

Pads: 9
SMD: 6.7×5.5
Boards: 68

TO-92_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 7.1×5.6
Boards: 66

DIP-24_W15.24mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 24
THT: 18.3×31.1
Boards: 63

LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y

FP3D

Package_LGA

LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)

Pads: 16
SMD: 3.5×3.5
Boards: 61

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 60

DIP-28_W15.24mm_Socket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 28
THT: 18.3×36.2
Boards: 59

DIP-24_W7.62mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 24
THT: 9.7×31.0
Boards: 57

SMDIP-4_W9.53mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 4
SMD: 12.0×5.6
Boards: 57

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

TSOP-II-54_22.2x10.16mm_P0.8mm

FP3D

Package_SO

54-lead TSOP typ II package

Pads: 54
SMD: 13.5×22.7
Boards: 55

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

QFN-48-1EP_7x7mm_P0.5mm_EP5.3x5.3mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62)

Pads: 49
SMD: 8.2×8.2
Boards: 53

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 51

TO-92L_Inline

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads: 3
THT: 5.5×4.6
Boards: 51