Footprints

1,441 footprints matching “MA”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,441 footprints · page 3 of 61

Matched by name and keywords. Search by meaning instead

SW_Tactile_Straight_KSA0Axx1LFTR

FP3D

Button_Switch_THT

SW PUSH SMALL http://www.ckswitches.com/media/1457/ksa_ksl.pdf

Pads: 2
THT: 9.5×7.9
Boards: 23

Molex_Pico-EZmate_78171-0004_1x04-1MP_P1.20mm_Vertical

FP—

Connector_Molex

Molex Pico-EZmate series connector, 78171-0004 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf)

Pads: 5
SMD: 7.6×5.8
Boards: 23

VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

Texas_S-PVSON-N10_ThermalVias

FP3D

Package_SON

3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 21

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 20

SMA_Molex_73251-2200_Horizontal

FP3D

Connector_Coaxial

https://tools.molex.com/pdm_docs/sd/732512200_sd.pdf

Pads: 2
THT: 8.8×21.2
Boards: 19

Fuseholder_TR5_Littelfuse_No560_No460

FP3D

Fuse

Fuse, Fuseholder, TR5, Littelfuse/Wickmann, No. 460, No560, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_holders/littelfuse_fuse_holder_559_560_datasheet.pdf.pdf

Pads: 2
THT: 10.0×10.0
Boards: 19

TerminalBlock_MaiXu_MX126-5.0-03P_1x03_P5.00mm

FP—

TerminalBlock

terminal block MaiXu MX126-5.0-03P, 3 pins, pitch 5mm, size 15.5x7.8mm, drill diameter 1.3mm, pad diameter 2.8mm, https://www.lcsc.com/datasheet/lcsc_datasheet_2309150913_MAX-MX126-5-0-03P-GN01-Cu-S-A_C5188435.pdf

Pads: 3
THT: 16.5×8.8
Boards: 19

SW_MEC_5GSH9

FP—

Button_Switch_SMD

MEC 5G single pole normally-open tactile switch

Pads: 4
SMD: 10.6×15.6
Boards: 18

Jack_3.5mm_KoreanHropartsElec_PJ-320D-4A_Horizontal

FP—

Connector_Audio

Korean Hroparts Elec PJ-320D-4A (https://datasheet.lcsc.com/lcsc/1810121716_Korean-Hroparts-Elec-PJ-320D-4A_C95562.pdf)

Pads: 4
SMD: 15.1×10.0
Boards: 18

MMCX_Molex_73415-1471_Vertical

FP3D

Connector_Coaxial

http://www.molex.com/pdm_docs/sd/734151471_sd.pdf

Pads: 2
THT: 4.8×4.8
Boards: 18

WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias

FP—

Package_SON

WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf

Pads: 13
SMD: 2.9×3.5
Boards: 18

SMA_Amphenol_132203-12_Horizontal

FP—

Connector_Coaxial

https://www.amphenolrf.com/library/download/link/link_id/596063/parent/132203-12/

Pads: 2
THT: 9.0×24.5
Boards: 17

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 17

USB_A_TE_292303-7_Horizontal

FP3D

Connector_USB

USB type A, Horizontal, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=292303&DocType=Customer+Drawing&DocLang=English

Pads: 5
SMD: 17.2×16.5
Boards: 16

L_Wuerth_MAPI-3015

FP3D

Inductor_SMD

Inductor, Wuerth, MAPI-3015, 3.0x3.0x1.5mm, (https://www.we-online.com/en/components/products/WE-MAPI?kicad)

Pads: 2
SMD: 3.9×3.9
Boards: 16

L_Wuerth_MAPI-3020

FP3D

Inductor_SMD

Inductor, Wuerth, MAPI-3020, 3.0x3.0x2.0mm, (https://www.we-online.com/en/components/products/WE-MAPI?kicad)

Pads: 2
SMD: 3.9×3.9
Boards: 16

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16