Footprints
3,718 footprints matching “SO”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOT-223
Package_TO_SOT_SMD
module CMS SOT223 4 pins
- Pads
- 4
- SMD
- 8.8×7.2
- Boards
- 384
SO-8_3.9x4.9mm_P1.27mm
Package_SO
SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 380
DIP-16_W7.62mm_Socket
Package_DIP
16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- 373
TO-92_Inline_Wide
Package_TO_SOT_THT
TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 7.1×4.7
- Boards
- 358
TSOT-23-6
Package_TO_SOT_SMD
TSOT, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA)
- Pads
- 6
- SMD
- 4.1×3.4
- Boards
- 352
SOT-323_SC-70
Package_TO_SOT_SMD
SOT, 3 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=148)
- Pads
- 3
- SMD
- 2.9×2.2
- Boards
- 350
MSOP-8_3x3mm_P0.65mm
Package_SO
MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 348
SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm
Jumper
SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 339
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
PinSocket_1x10_P2.54mm_Vertical
Connector_PinSocket_2.54mm
Through hole straight socket strip, 1x10, 2.54mm pitch, single row (from Kicad 4.0.7), script generated
- Pads
- 10
- THT
- 3.5×26.4
- Boards
- 329
DIP-8_W7.62mm_Socket
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 8
- THT
- 10.7×10.8
- Boards
- 322
SOT-23-6_Handsoldering
Package_TO_SOT_SMD
6-pin SOT-23 package, Handsoldering
- Pads
- 6
- SMD
- 4.8×3.6
- Boards
- 316
SOT-143
Package_TO_SOT_SMD
SOT-143 https://www.nxp.com/docs/en/package-information/SOT143B.pdf
- Pads
- 4
- SMD
- 3.2×3.4
- Boards
- 308
L_0603_1608Metric_Pad1.05x0.95mm_HandSolder
Inductor_SMD
Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 3.3×1.5
- Boards
- 295
SOIC-16W_7.5x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf)
- Pads
- 16
- SMD
- 11.9×10.8
- Boards
- 282
SOIC-20W_7.5x12.8mm_P1.27mm
Package_SO
SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)
- Pads
- 20
- SMD
- 11.9×13.3
- Boards
- 279
Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder
Fuse
Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 4.9×2.3
- Boards
- 275
D_SMA_Handsoldering
Diode_SMD
Diode SMA (DO-214AC) Handsoldering
- Pads
- 2
- SMD
- 9.0×3.5
- Boards
- 273
TSOT-23-5
Package_TO_SOT_SMD
TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)
- Pads
- 5
- SMD
- 4.1×3.4
- Boards
- 256
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
C_1210_3225Metric_Pad1.33x2.70mm_HandSolder
Capacitor_SMD
Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 5.0×3.2
- Boards
- 241
D_DO-41_SOD81_P7.62mm_Horizontal
Diode_THT
Diode, DO-41_SOD81 series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.2*2.7mm^2, https://www.diodes.com/assets/Package-Files/DO-41-Plastic.pdf
- Pads
- 2
- THT
- 10.3×3.2
- Boards
- 227
SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 227