Footprints

512 footprints matching “SO-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

512 footprints · page 3 of 22

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SSOP-8_3.95x5.21x3.27mm_P1.27mm

FP3D

Package_SO

SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm

Pads: 8
SMD: 7.2×5.7
Boards: 22

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads: 9
SMD: 2.8×2.5
Boards: 20

SMDIP-8_W9.53mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 8
SMD: 12.0×10.7
Boards: 20

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm

FP—

Package_SON

WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))

Pads: 9
SMD: 8.7×6.5
Boards: 20

DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm

FP—

Package_DFN_QFN

DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf)

Pads: 9
SMD: 4.2×2.5
Boards: 19

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

DIP-8_W10.16mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 8
THT: 12.3×10.7
Boards: 17

SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads: 8
SMD: 13.0×6.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

VSON-8_3.3x3.3mm_P0.65mm_NexFET

FP3D

Package_SON

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf

Pads: 5
SMD: 4.0×3.8
Boards: 16

DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 15

DIP-8_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 8
SMD: 10.7×10.8
Boards: 14

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: 14

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 14

DFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.6mm

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.qorvo.com/products/d/da007268)

Pads: 9
SMD: 3.2×2.5
Boards: 13

DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)

Pads: 9
SMD: 3.3×3.5
Boards: 13

DFN-8-1EP_6x5mm_P1.27mm_EP2x2mm

FP—

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download)

Pads: 9
SMD: 7.4×5.6
Boards: 13

NXP_LGA-8_3x5mm_P1.25mm_H1.1mm

FP—

Package_LGA

NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42)

Pads: 8
SMD: 4.0×5.5
Boards: 13

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 13

PowerIntegrations_SO-8

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf

Pads: 8
SMD: 8.0×5.4
Boards: 13