Footprints

63 footprints matching “array”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

63 footprints · page 3 of 3

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RESNET 1506-16 CONVEX

FP—

celestial-altium-Resistor_Array

Array Chip Resistor, 16 leads, 8 resistors, Body 3.8x1.6mm Height 0.55mm

Pads: 16
SMD: 2.4×4.6
Boards: —

RESNET 1606-16 CONVEX

FP—

celestial-altium-Resistor_Array

Array Chip Resistor, 16 leads, 8 resistors

Pads: 16
SMD: 2.2×4.6
Boards: —

RESNET 2506-16 CONCAVE

FP—

celestial-altium-Resistor_Array

8 resistor 6.40x1.60mm, 0.7mm high

Pads: 16
SMD: 3.2×6.9
Boards: —

VISHAY ACAS 0606 AT

FP—

celestial-altium-Resistor_Array

Chip Resistor Array

Pads: 4
SMD: 2.2×1.8
Boards: —

L_Taiyo-Yuden_BK_Array_1206_3216Metric

FP—

Inductor_SMD

Ferrite Bead Array 4x0603, Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf)

Pads: 8
SMD: 3.0×3.7
Boards: —

Bosch_LGA-8_2.5x2.5mm_P0.65mm_ClockwisePinNumbering

FP—

jlcpcb-JLCPCB

LGA-8

Pads: 8
SMD: 2.8×3.1
Boards: —

R_0402x4

FP—

jlcpcb-JLCPCB

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf)

Pads: 8
SMD: 1.5×2.0
Boards: —

R_0603x4

FP—

jlcpcb-JLCPCB

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads: 8
SMD: 3.1×3.8
Boards: —

FILTER-ARRAY-SMD_0805-4P-L2.0-W1.3-BL_BWCU

FP—

jlcpcb-JLCPCB-Kicad-Footprints

FILTER-ARRAY-SMD_0805-4P-L2.0-W1.3-BL_BWCU footprint

Pads: 4
SMD: 3.0×1.5
Boards: —

SEAF-50-05.0-x-08-x-A-K

FP—

muratovas-MAS_Package_nostd

400 Position Connector High Density Array, Female Surface Mount Gold

Pads: 400
SMD: 71.5×12.0
Boards: —

L_Array_Concave_4x0402

FP3D

muratovas-MAS_Package_std

Chip Common Mode Choke Coil Arrays

Pads: 8
SMD: 2.0×2.5
Boards: —

LGA-12_2x2mm_P0.5mm

FP3D

muratovas-MAS_Package_std

LGA12

Pads: 12
SMD: 2.5×2.5
Boards: —

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads: 12
SMD: 4.1×3.6
Boards: —

Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm

FP—

Package_CSP

Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet

Pads: 34
SMD: 6.5×3.7
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —