Footprints

280 footprints matching “ssop”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

280 footprints · page 3 of 12

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SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads: 56
SMD: 11.1×19.1
Boards: 5

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 21
SMD: 7.7×7.0
Boards: 4

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm

FP—

Package_SO

HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)

Pads: 25
SMD: 7.8×8.3
Boards: 4

TSSOP-14-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)

Pads: 15
SMD: 7.9×5.6
Boards: 4

Freescale_98ARH99066A

FP—

Sensor_Pressure

https://www.nxp.com/docs/en/data-sheet/MPXH6250A.pdf

Pads: 8
SMD: 12.0×8.5
Boards: 4

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm_ThermalVias

FP—

Package_SO

HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

SSOP-48_5.3x12.8mm_P0.5mm

FP—

Package_SO

SSOP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/05081887_A_G48.pdf)

Pads: 48
SMD: 9.4×13.3
Boards: 3

Texas_S-PDSO-G8_3x3mm_P0.65mm

FP—

Package_SO

plastic small outline, https://www.ti.com/lit/ml/mpds028d/mpds028d.pdf, https://www.ti.com/lit/ds/symlink/dac8552.pdf#page=23

Pads: 8
SMD: 6.4×3.5
Boards: 3

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm_ThermalVias

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads: 17
SMD: 7.8×5.5
Boards: 3

TSSOP-30_4.4x7.8mm_P0.5mm

FP3D

Package_SO

TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 30
SMD: 7.7×8.3
Boards: 3

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads: 21
SMD: 7.7×7.0
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2

SSOP-4_4.4x2.6mm_P1.27mm

FP—

Package_SO

SSOP, 4 Pin (https://www.vishay.com/docs/83465/vos618a.pdf)

Pads: 4
SMD: 8.4×3.1
Boards: 2

SSOP-44_5.3x12.8mm_P0.5mm

FP3D

Package_SO

44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)

Pads: 44
SMD: 8.5×13.3
Boards: 2

Texas_DYY0016A_TSOT-23-16_2x4.2mm_P0.5mm

FP—

Package_SO

Texas DYY0016A TSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tmux1574.pdf#page=42)

Pads: 16
SMD: 4.6×4.7
Boards: 2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads: 21
SMD: 8.2×7.0
Boards: 2

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads: 17
SMD: 7.8×5.5
Boards: 2