Footprints

514 footprints matching “vias”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

514 footprints · page 3 of 22

Matched by name and keywords. Search by meaning instead

Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)

Pads: 25
SMD: 5.3×5.3
Boards: 9

WQFN-16-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59)

Pads: 17
SMD: 5.3×5.3
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9

Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP—

Package_SO

HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 9

Texas_S-PWSON-N10_ThermalVias

FP—

Package_SON

3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf

Pads: 11
SMD: 4.3×4.1
Boards: 9

DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias

FP3D

Package_DFN_QFN

DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)

Pads: 11
SMD: 4.3×3.5
Boards: 8

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 8

Texas_RHA0040B_VQFN-40-1EP_6x6mm_P0.5mm_EP4.15x4.15mm_ThermalVias

FP—

Package_DFN_QFN

Texas RHA0040B VQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=72 JEDEC MO-220 variation VJJD-2)

Pads: 41
SMD: 7.3×7.3
Boards: 8

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 8

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 7

QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)

Pads: 33
SMD: 6.3×6.3
Boards: 7

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 7

WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)

Pads: 17
SMD: 4.3×4.3
Boards: 7

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 7