Footprints

7,824 footprints matching “On”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

7,824 footprints · page 30 of 326

Matched by name and keywords. Search by meaning instead

SolderWire-2sqmm_1x02_P7.8mm_D2mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 2 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 2
THT: 13.2×4.9
Boards: 9

Converter_ACDC_MeanWell_IRM-02-xx_THT

FP3D

Converter_ACDC

ACDC-Converter, 2W, Meanwell, IRM-02, THT, https://www.meanwell.co.uk/media/productPDF/IRM-02-spec.pdf

Pads: 4
THT: 34.2×22.7
Boards: 9

Converter_ACDC_MeanWell_IRM-05-xx_THT

FP—

Converter_ACDC

http://www.meanwell.com/webapp/product/search.aspx?prod=IRM-05

Pads: 4
THT: 46.2×25.9
Boards: 9

Converter_DCDC_Murata_NMAxxxxSC_THT

FP3D

Converter_DCDC

Murata NMAxxxxSC footprint based on SIP7, http://power.murata.com/data/power/ncl/kdc_nma.pdf

Pads: 5
THT: 6.5×20.0
Boards: 9

Crystal_HC18-U_Horizontal_1EP_style2

FP3D

Crystal

HC18/U, Crystal, length 13.0mm, width 10.9mm, THT, http://5hertz.com/pdfs/04404_D.pdf

Pads: 3
THT: 13.5×17.8
Boards: 9

Crystal_SMD_SeikoEpson_FA238V-4Pin_3.2x2.5mm

FP3D

Crystal

Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf

Pads: 4
SMD: 4.3×3.6
Boards: 9

D_T-1_P10.16mm_Horizontal

FP3D

Diode_THT

Diode, T-1 series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf

Pads: 2
THT: 12.7×3.1
Boards: 9

Sx39-1xxxxx

FP—

Display_7Segment

Single digit 7 segment LED display in red, yellow or green colour http://www.kingbrightusa.com/images/catalog/SPEC/sa39-11ewa.pdf

Pads: 10
THT: 10.5×13.5
Boards: 9

L_Axial_L11.0mm_D4.5mm_P15.24mm_Horizontal_Fastron_MECC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=11*4.5mm^2, Fastron, MECC, http://www.fastrongroup.com/image-show/21/MECC.pdf?type=Complete-DataSheet&productType=series

Pads: 2
THT: 17.8×5.0
Boards: 9

L_Axial_L9.5mm_D4.0mm_P15.24mm_Horizontal_Fastron_SMCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf

Pads: 2
THT: 17.8×4.5
Boards: 9

OnSemi_CASE100CY

FP3D

OptoDevice

OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF

Pads: 4
SMD: 3.7×6.2
Boards: 9

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9