Footprints

941 footprints matching “27mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

941 footprints · page 36 of 40

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WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads: 9
SMD: 9.2×6.5
Boards: —

MO047AD_PLCC-52_19.1x19.1mm_P1.27mm

FP—

Package_LCC

MO047AD PLCC, 52 Pin (JEDEC MO-047 variation AD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-047, https://archive.org/details/bitsavers_signeticsdcsMicroprocessor_53987793/page/n775/mode/1up?view=theater)

Pads: 52
SMD: 20.7×20.7
Boards: —

PLCC-20_9.0x9.0mm_P1.27mm

FP—

Package_LCC

PLCC, 20 Pin (http://www.nxp.com/docs/en/package-information/SOT380-1.pdf)

Pads: 20
SMD: 10.6×10.6
Boards: —

PLCC-68_24.2x24.2mm_P1.27mm

FP—

Package_LCC

PLCC, 68 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)

Pads: 68
SMD: 25.8×25.8
Boards: —

PLCC-84_29.3x29.3mm_P1.27mm

FP—

Package_LCC

PLCC, 84 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)

Pads: 84
SMD: 30.9×30.9
Boards: —

LGA-8_8x6.2mm_P1.27mm

FP—

Package_LGA

LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17)

Pads: 8
SMD: 9.2×6.7
Boards: —

Linear_LGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_LGA

Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 133
SMD: 15.5×15.5
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×18.2
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 20
SMD: 15.9×16.4
Boards: —

Infineon_SOIC-20W_7.6x12.8mm_P1.27mm

FP—

Package_SO

Infineon SOIC, 20 Pin (https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_SPO_PDF-Package-v15_00-EN.pdf?fileId=5546d4625c54d85b015c627e1a0c23b3, https://www.infineon.com/dgdl/Infineon-PG-DSO-20-77_FPD_PDF-Footprint-v15_00-EN.pdf?fileId=5546d4625c54d85b015c5f0f49614324)

Pads: 20
SMD: 11.9×13.3
Boards: —

JEITA_SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)

Pads: 16
SMD: 7.7×10.4
Boards: —

PSOP-44_16.9x27.17mm_P1.27mm

FP3D

Package_SO

PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm

Pads: 44
SMD: 19.2×28.8
Boards: —

Renesas_SOP-32_11.4x20.75mm_P1.27mm

FP—

Package_SO

Renesas SOP, 32 Pin (https://www.renesas.com/en/document/psc/package-drawing-sop-32pin-prsp0032df)

Pads: 32
SMD: 15.6×21.3
Boards: —

SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm_ThermalVias

FP—

Package_SO

SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)

Pads: 21
SMD: 11.9×13.3
Boards: —

SOIC-14-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)

Pads: 14
SMD: 7.4×10.4
Boards: —

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads: 5
SMD: 8.4×4.1
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.71x3.7mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.aosmd.com/res/datasheets/AOZ1284PI.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: —