Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 38 of 250

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Texas_DSBGA-9_1.62x1.58mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.62mmx1.58mm, area grid, NSMD, YZF0009 pad definition, 1.62x1.58mm, 9 Ball, 3x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg027n/mxbg027n.pdf

Pads: 9
SMD: 3.6×3.6
Boards: 4

DFN-8-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf#page=10)

Pads: 9
SMD: 4.3×3.5
Boards: 4

DFN-8-1EP_6x5mm_P1.27mm_EP4x4mm

FP—

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download)

Pads: 9
SMD: 7.4×5.7
Boards: 4

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)

Pads: 9
SMD: 3.2×2.5
Boards: 4

QFN-24-1EP_4x4mm_P0.5mm_EP2.8x2.8mm

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/hmc431.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 4

QFN-24-1EP_4x4mm_P0.5mm_EP2.8x2.8mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/hmc431.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 4

QFN-28-1EP_4x4mm_P0.4mm_EP2.4x2.4mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280)

Pads: 29
SMD: 5.2×5.2
Boards: 4

QFN-28-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2202_TMC2208_TMC2224_datasheet_rev1.14.pdf#page=77)

Pads: 29
SMD: 6.2×6.2
Boards: 4

QFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm

FP—

Package_DFN_QFN

QFN, 40 Pin (http://www.issi.com/WW/pdf/31FL3736.pdf#page=28)

Pads: 41
SMD: 6.3×6.3
Boards: 4

QFN-56-1EP_8x8mm_P0.5mm_EP5.6x5.6mm

FP—

Package_DFN_QFN

QFN, 56 Pin (http://www.ti.com/lit/ds/symlink/tlc5957.pdf#page=23)

Pads: 57
SMD: 9.3×9.3
Boards: 4

QFN-56-1EP_8x8mm_P0.5mm_EP5.9x5.9mm

FP—

Package_DFN_QFN

QFN, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001734B.pdf#page=50)

Pads: 57
SMD: 9.3×9.3
Boards: 4

TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)

Pads: 9
SMD: 4.2×2.5
Boards: 4

WQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44)

Pads: 17
SMD: 4.3×4.3
Boards: 4

CERDIP-8_W7.62mm_SideBrazed

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 9.7×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.5×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 4

DIP-48_W15.24mm_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 48
THT: 18.1×61.5
Boards: 4

Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads: 8
SMD: 6.3×6.4
Boards: 4

AMS_OLGA-8_2x3.1mm_P0.8mm

FP—

Package_LGA

AMS OLGA, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63)

Pads: 8
SMD: 2.5×3.6
Boards: 4

TQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 128
SMD: 17.3×17.3
Boards: 4

TQFP-80_12x12mm_P0.5mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation ADD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-00092c.pdf)

Pads: 80
SMD: 15.3×15.3
Boards: 4

SIP-8_19x3mm_P2.54mm

FP3D

Package_SIP

SIP 8-pin (http://www.njr.com/semicon/PDF/package/SIP8_E.pdf)

Pads: 8
THT: 19.7×3.5
Boards: 4

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 21
SMD: 7.7×7.0
Boards: 4

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm

FP—

Package_SO

HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)

Pads: 25
SMD: 7.8×8.3
Boards: 4