CERDIP-8_W7.62mm_SideBrazed

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Footprint

8 pads
Footprint CERDIP-8_W7.62mm_SideBrazed
Mount
Through hole
Courtyard
9.73 × 13.72 mm
Pads
8
File
4 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

10 components in the catalog place this footprint

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
EPC Artemis 2025 BOARD12731372107.5 × 89.62 mmCC-BY-4.0MUNAKATA-EPC/Artemis_2025 ↗
Gps Controlled Lcd Shutter42722100 × 84.91 mmCC-BY-4.0hadoopmarc/gps-controlled-lcd-shutter ↗
EscDesign3255275.95 × 59.44 mmCC-BY-4.0AVSRAVITEJA/escDesign ↗
DC PABLO ANDRADE IMT 322 BOARD21610260 × 35.5 mmCC-BY-4.0Pablo15x/DC-PABLO-ANDRADE-IMT-322 ↗

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception