Footprints
310 footprints matching “8-pin”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 6
TerminalBlock_Xinya_XY308-2.54-8P_1x08_P2.54mm_Horizontal
TerminalBlock
Terminal Block Xinya XY308-2.54-8P, 8 pins, pitch 2.54mm, size 20.8x6.5mm, drill diameter 1.2mm, pad diameter 2mm, http://www.xinyaelectronic.com/product/xy308-254
- Pads
- 8
- THT
- 21.8×7.5
- Boards
- 6
Hirose_FH12-8S-0.5SH_1x08-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-8S-0.5SH, 8 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 9
- SMD
- 10.1×7.9
- Boards
- 5
Molex_Mini-Fit_Jr_5569-16A2_2x08_P4.20mm_Horizontal
Connector_Molex
Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-16A2, example for new mpn: 39-30-0160, 8 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf)
- Pads
- 16
- THT
- 35.8×22.3
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
MicroCrystal_C7_SON-8_1.5x3.2mm_P0.9mm
Package_SON
MicroCrystal C7 SON, 8 Pin (https://www.microcrystal.com/fileadmin/Media/Products/RTC/App.Manual/RV-3028-C7_App-Manual.pdf#page=107)
- Pads
- 8
- SMD
- 2.8×3.9
- Boards
- 5
Molex_Micro-Fit_3.0_43045-1621_2x08-1MP_P3.00mm_Horizontal
Connector_Molex
Molex Micro-Fit 3.0 Connector System, 43045-1621 (alternative finishes: 43045-162x), 8 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf)
- Pads
- 17
- THT
- 29.7×13.7
- Boards
- 4
Molex_Micro-Latch_53253-0870_1x08_P2.00mm_Vertical
Connector_Molex
Molex Micro-Latch Wire-to-Board Connector System, 53253-0870 (compatible alternatives: 53253-0850), 8 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)
- Pads
- 8
- THT
- 19.0×4.7
- Boards
- 4
Molex_Nano-Fit_105310-xx16_2x08_P2.50mm_Vertical
Connector_Molex
Molex Nano-Fit Power Connectors, 105310-xx16, 8 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf)
- Pads
- 16
- THT
- 9.8×22.0
- Boards
- 4
DFN-8-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf#page=10)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 4
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 4
TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm
Package_DFN_QFN
TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- 4
Analog_LCC-8_5x5mm_P1.27mm
Package_LCC
LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf
- Pads
- 8
- SMD
- 6.3×6.4
- Boards
- 4
AMS_OLGA-8_2x3.1mm_P0.8mm
Package_LGA
AMS OLGA, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63)
- Pads
- 8
- SMD
- 2.5×3.6
- Boards
- 4
SIP-8_19x3mm_P2.54mm
Package_SIP
SIP 8-pin (http://www.njr.com/semicon/PDF/package/SIP8_E.pdf)
- Pads
- 8
- THT
- 19.7×3.5
- Boards
- 4
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 4
TSOT-23-8_HandSoldering
Package_TO_SOT_SMD
8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf
- Pads
- 8
- SMD
- 5.9×3.4
- Boards
- 4
TerminalBlock_RND_205-00018_1x08_P5.00mm_Horizontal
TerminalBlock_RND
terminal block RND 205-00018, 8 pins, pitch 5mm, size 40x7.6mm, drill diameter 1.3mm, pad diameter 2.5mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf
- Pads
- 8
- THT
- 41.0×8.6
- Boards
- 4
TerminalBlock_RND_205-00238_1x08_P5.08mm_Horizontal
TerminalBlock_RND
terminal block RND 205-00238, 8 pins, pitch 5.08mm, size 40.6x8.45mm, drill diameter 1.1mm, pad diameter 2.1mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf
- Pads
- 8
- THT
- 41.6×9.4
- Boards
- 4
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)
- Pads
- 9
- SMD
- 3.3×2.5
- Boards
- 3
MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm
Package_DFN_QFN
8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)
- Pads
- 9
- SMD
- 3.7×3.5
- Boards
- 3
WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 3
LGA-8_8x6mm_P1.27mm
Package_LGA
LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6)
- Pads
- 8
- SMD
- 9.2×6.5
- Boards
- 3
HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm_ThermalVias
Package_SO
HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3