Footprints

372 footprints matching “DIL”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

372 footprints · page 4 of 16

Matched by name and keywords. Search by meaning instead

Osram_BPW34S-SMD

FP—

OptoDevice

PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5488319/BPW%2034%20S_EN.pdf

Pads: 2
SMD: 8.0×4.5
Boards: 8

DIP-42_W15.24mm

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 42
THT: 17.3×53.9
Boards: 8

DIP-64_W22.86mm_Socket

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket

Pads: 64
THT: 25.9×81.9
Boards: 8

DIP-64_W22.86mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads

Pads: 64
THT: 25.9×81.9
Boards: 8

DIP-4_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 4
SMD: 10.7×5.7
Boards: 7

DIP-48_W15.24mm_Socket_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 48
THT: 18.3×61.6
Boards: 7

DIP-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 6
THT: 10.7×8.2
Boards: 7

Oscillator_SeikoEpson_SG-8002DC

FP3D

Oscillator

8-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 4
THT: 9.8×14.0
Boards: 6

DIP-4_W7.62mm_Socket

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 4
THT: 10.7×5.7
Boards: 6

DIP-6_W10.16mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 6
THT: 12.3×8.1
Boards: 6

DIP-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 6
SMD: 10.7×8.2
Boards: 6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-6_W9.53mm_Clearance8mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 6
SMD: 11.5×8.1
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

DIP-14_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 14
SMD: 10.7×18.4
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

Osram_DIL2_4.3x4.65mm_P5.08mm

FP—

OptoDevice

PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08

Pads: 2
THT: 7.3×4.8
Boards: 4

Osram_SFH2430

FP—

OptoDevice

PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467144/SFH%202430_EN.pdf

Pads: 2
SMD: 8.0×4.5
Boards: 4

CERDIP-8_W7.62mm_SideBrazed

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 9.7×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.5×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 4

DIP-10_W7.62mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 10
THT: 10.5×13.2
Boards: 4