Footprints

167 footprints matching “Plastic”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

167 footprints · page 4 of 7

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TSSOP-14-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)

Pads: 15
SMD: 7.9×5.6
Boards: 4

WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.9×3.5
Boards: 4

Molex_Mini-Fit_Jr_5566-02A2_2x01_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-02A2, example for new mpn: 39-28-902x, 1 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 2
THT: 13.4×12.0
Boards: 3

Molex_Mini-Fit_Jr_5566-12A2_2x06_P4.20mm_Vertical

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-12A2, example for new mpn: 39-28-912x, 6 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)

Pads: 12
THT: 34.4×12.0
Boards: 3

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 13
SMD: 4.3×3.6
Boards: 3

DFN-6_1.3x1.2mm_P0.4mm

FP—

Package_DFN_QFN

6-Lead Plastic DFN (1.3mm x 1.2mm)

Pads: 6
SMD: 1.6×1.4
Boards: 3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 7.2×5.7
Boards: 3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

PowerIntegrations_SO-8C

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

Texas_S-PDSO-G8_3x3mm_P0.65mm

FP—

Package_SO

plastic small outline, https://www.ti.com/lit/ml/mpds028d/mpds028d.pdf, https://www.ti.com/lit/ds/symlink/dac8552.pdf#page=23

Pads: 8
SMD: 6.4×3.5
Boards: 3

Texas_S-PVSON-N8

FP3D

Package_SON

8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf

Pads: 9
SMD: 4.2×3.6
Boards: 3

Molex_Mini-Fit_Jr_5569-12A2_2x06_P4.20mm_Horizontal

FP—

Connector_Molex

Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-12A2, example for new mpn: 39-30-0120, 6 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf)

Pads: 12
THT: 27.4×22.3
Boards: 2

DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm

FP—

Package_DFN_QFN

14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)

Pads: 15
SMD: 4.4×5.0
Boards: 2

Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm

FP—

Package_DFN_QFN

40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet)

Pads: 34
SMD: 6.9×8.9
Boards: 2

QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm

FP3D

Package_DFN_QFN

64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 65
SMD: 10.3×10.3
Boards: 2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2

SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 6
SMD: 11.2×5.1
Boards: 2