Footprints

1,347 footprints matching “0.5”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,347 footprints · page 42 of 57

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UFBGA-100_7x7mm_Layout12x12_P0.5mm

FP—

Package_BGA

UFBGA-100, 7.0x7.0mm, 100 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=93

Pads: 100
SMD: 9.0×9.0
Boards: —

UFBGA-132_7x7mm_Layout12x12_P0.5mm

FP—

Package_BGA

UFBGA-132, 7.0x7.0mm, 132 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32l152zc.pdf#page=123

Pads: 132
SMD: 9.0×9.0
Boards: —

UFBGA-132_7x7mm_P0.5mm

FP—

Package_BGA

UFBGA 132 Pins, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf

Pads: 132
SMD: 9.0×9.0
Boards: —

UFBGA-144_7x7mm_Layout12x12_P0.5mm

FP—

Package_BGA

UFBGA-144, 7.0x7.0mm, 144 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f446ze.pdf#page=186

Pads: 144
SMD: 9.0×9.0
Boards: —

UFBGA-169_7x7mm_Layout13x13_P0.5mm

FP—

Package_BGA

UFBGA-169, 7.0x7.0mm, 169 Ball, 13x13 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f429ng.pdf#page=218

Pads: 169
SMD: 9.0×9.0
Boards: —

UFBGA-32_4.0x4.0mm_Layout6x6_P0.5mm

FP—

Package_BGA

UFBGA-32, 6x6, 4x4mm package, pitch 0.5mm

Pads: 32
SMD: 6.0×6.0
Boards: —

VFBGA-86_6x6mm_Layout10x10_P0.55mm

FP—

Package_BGA

VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740

Pads: 86
SMD: 8.0×8.0
Boards: —

XFBGA-36_3.5x3.5mm_Layout6x6_P0.5mm

FP—

Package_BGA

XFBGA-36, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf

Pads: 36
SMD: 5.7×5.7
Boards: —

XFBGA-64_5.0x5.0mm_Layout8x8_P0.5mm

FP—

Package_BGA

XFBGA-64, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf

Pads: 64
SMD: 7.0×7.0
Boards: —

Xilinx_CPGA196

FP—

Package_BGA

Spartan-7 BGA, NSMD pad definition Appendix A, 8x8mm, 196 Ball, 14x14 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260

Pads: 196
SMD: 10.0×10.0
Boards: —

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

FP—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads: 5
SMD: 4.0×3.5
Boards: —

LFCSP-10_2x2mm_P0.5mm

FP3D

Package_CSP

LFCSP, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/cp_10_11.pdf)

Pads: 10
SMD: 3.2×3.2
Boards: —

LFCSP-16_3x3mm_P0.5mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf)

Pads: 16
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm

FP—

Package_CSP

16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)

Pads: 17
SMD: 4.2×4.2
Boards: —