Footprints

1,138 footprints matching “1EP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,138 footprints · page 45 of 48

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HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 37
SMD: 15.9×16.6
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp

FP3D

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 36
SMD: 15.9×16.4
Boards: —

HSOP-54-1EP_7.5x17.9mm_P0.65mm_EP4.6x4.6mm

FP—

Package_SO

HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf)

Pads: 55
SMD: 11.6×18.4
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —