Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 45 of 250

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PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 8
SMD: 11.1×10.7
Boards: 3

PLCC-28

FP—

Package_LCC

PLCC, 28 pins, surface mount

Pads: 28
SMD: 13.5×13.5
Boards: 3

PLCC-84

FP—

Package_LCC

PLCC, 84 pins, surface mount

Pads: 84
SMD: 31.3×31.3
Boards: 3

LGA-8_8x6mm_P1.27mm

FP—

Package_LGA

LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6)

Pads: 8
SMD: 9.2×6.5
Boards: 3

LQFP-208_28x28mm_P0.5mm

FP3D

Package_QFP

LQFP, 208 Pin (https://www.nxp.com/docs/en/package-information/SOT459-1.pdf)

Pads: 208
SMD: 31.4×31.4
Boards: 3

LQFP-80_10x10mm_P0.4mm

FP3D

Package_QFP

LQFP, 80 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q80.10x10.pdf)

Pads: 80
SMD: 13.3×13.3
Boards: 3

PQFP-80_14x20mm_P0.8mm

FP3D

Package_QFP

PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)

Pads: 80
SMD: 18.5×24.5
Boards: 3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm_ThermalVias

FP—

Package_SO

HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

Infineon_PG-DSO-8-27_3.9x4.9mm_EP2.65x3mm

FP—

Package_SO

Infineon PG-DSO, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27)

Pads: 9
SMD: 7.4×5.4
Boards: 3

MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)

Pads: 17
SMD: 6.3×4.5
Boards: 3

MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)

Pads: 9
SMD: 6.3×3.5
Boards: 3

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm

FP3D

Package_SO

MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)

Pads: 9
SMD: 6.2×3.5
Boards: 3

PowerIntegrations_SO-8C

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: 3