Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

5,977 footprints · page 5 of 250

Matched by name and keywords. Search by meaning instead

Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles

FP—

Connector_Audio

TRS 3.5mm, vertical, Thonkiconn, PCB mount, (http://www.qingpu-electronics.com/en/products/WQP-PJ398SM-362.html)

Pads
3
THT
10.0×14.4
Boards
117

USB_Micro-B_Amphenol_10118194_Horizontal

FP—

Connector_USB

USB Micro-B receptacle, horizontal, SMD, 10118194, 10118194-0011LF, 10118194-0012LF, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118194.pdf

Pads
6
SMD
8.9×6.5
Boards
115

Converter_DCDC_RECOM_R-78E-0.5_THT

FP3D

Converter_DCDC

DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf

Pads
3
THT
12.1×9.0
Boards
111

LED_WS2812B-2020_PLCC4_2.0x2.0mm

FP—

LED_SMD

2.0mm x 2.0mm Addressable RGB LED NeoPixel Nano, 12 mA, https://cdn-shop.adafruit.com/product-files/4684/4684_WS2812B-2020_V1.3_EN.pdf

Pads
4
SMD
3.0×2.5
Boards
111

SSOP-24_5.3x8.2mm_P0.65mm

FP3D

Package_SO

SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)

Pads
24
SMD
9.4×8.7
Boards
111

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads
8
SMD
5.9×3.6
Boards
111

D_DO-34_SOD68_P7.62mm_Horizontal

FP3D

Diode_THT

Diode, DO-34_SOD68 series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=3.04*1.6mm^2, https://www.nxp.com/docs/en/data-sheet/KTY83_SER.pdf

Pads
2
THT
9.6×2.1
Boards
110

D_SOD-128

FP3D

Diode_SMD

D_SOD-128 (CFP5 SlimSMAW), https://assets.nexperia.com/documents/outline-drawing/SOD128.pdf

Pads
2
SMD
6.3×3.0
Boards
109

Fuse_0805_2012Metric_Pad1.15x1.40mm_HandSolder

FP3D

Fuse

Fuse SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)

Pads
2
SMD
3.7×1.9
Boards
107

CP_Elec_6.3x5.8

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Nichicon, 6.3x5.8mm

Pads
2
SMD
9.4×7.1
Boards
104

TI_SO-PowerPAD-8_ThermalVias

FP—

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Pads
9
SMD
7.5×5.5
Boards
103

CP_Elec_8x10.5

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Vishay 0810, 8.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf

Pads
2
SMD
12.3×9.0
Boards
102

MountingHole_3.2mm_M3_ISO14580

FP—

MountingHole

Mounting Hole 3.2mm, M3, no annular, generated by kicad-footprint-generator mountinghole.py

Pads
—
Mount
6.0×6.0
Boards
102

Bosch_LGA-8_2x2.5mm_P0.65mm_ClockwisePinNumbering

FP3D

Package_LGA

LGA-8, https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMP280-DS001-18.pdf

Pads
8
SMD
3.1×2.6
Boards
101

CP_Radial_D7.5mm_P2.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=2.50mm, diameter=7.5mm, height=8mm, Electrolytic Capacitor

Pads
2
THT
8.0×8.0
Boards
100

DIP-18_W7.62mm

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
18
THT
9.7×23.4
Boards
99

TerminalBlock_Phoenix_MKDS-1,5-3-5.08_1x03_P5.08mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-3-5.08, 3 pins, pitch 5.08mm, size 15.2x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads
3
THT
16.3×10.8
Boards
98

USB_Mini-B_Lumberg_2486_01_Horizontal

FP3D

Connector_USB

USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf

Pads
6
SMD
11.9×10.6
Boards
96

PinSocket_2x08_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 2x08, 2.54mm pitch, double rows (from Kicad 4.0.7), script generated

Pads
16
THT
6.1×21.3
Boards
95

R_Axial_DIN0207_L6.3mm_D2.5mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=5.08mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads
2
THT
7.6×3.0
Boards
95

PinHeader_1x08_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x08, 2.54mm pitch, 6mm pin length, single row

Pads
8
THT
12.3×21.3
Boards
93

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads
100
SMD
17.3×17.3
Boards
93

C_1812_4532Metric

FP3D

Capacitor_SMD

Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads
2
SMD
6.0×3.9
Boards
92

microSD_HC_Molex_104031-0811

FP—

Connector_Card

1.10mm Pitch microSD Memory Card Connector, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch (https://www.molex.com/pdm_docs/sd/1040310811_sd.pdf)

Pads
11
SMD
13.7×13.1
Boards
91