Footprints

3,181 footprints matching “Package”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

3,181 footprints · page 5 of 133

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QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 115

LGA-12_2x2mm_P0.5mm

FP3D

Package_LGA

LGA12

Pads: 12
SMD: 2.5×2.5
Boards: 115

TSOT-23

FP3D

Package_TO_SOT_SMD

3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf

Pads: 3
SMD: 4.3×3.4
Boards: 112

Converter_DCDC_RECOM_R-78E-0.5_THT

FP3D

Converter_DCDC

DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf

Pads: 3
THT: 12.1×9.0
Boards: 111

SSOP-24_5.3x8.2mm_P0.65mm

FP3D

Package_SO

SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)

Pads: 24
SMD: 9.4×8.7
Boards: 111

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

TI_SO-PowerPAD-8_ThermalVias

FP—

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Pads: 9
SMD: 7.5×5.5
Boards: 103

TO-263-3_TabPin2

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/

Pads: 3
SMD: 16.6×11.3
Boards: 102

Bosch_LGA-8_2x2.5mm_P0.65mm_ClockwisePinNumbering

FP3D

Package_LGA

LGA-8, https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMP280-DS001-18.pdf

Pads: 8
SMD: 3.1×2.6
Boards: 101

DIP-20_W7.62mm_Socket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 20
THT: 10.7×26.0
Boards: 100

TO-92L_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads: 3
THT: 7.1×4.6
Boards: 100

DIP-18_W7.62mm

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 18
THT: 9.7×23.4
Boards: 99

DIP-40_W15.24mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 40
THT: 18.3×51.4
Boards: 99

SSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)

Pads: 16
SMD: 7.4×5.4
Boards: 98

PLCC-44_THT-Socket

FP—

Package_LCC

PLCC, 44 pins, through hole

Pads: 44
THT: 24.5×24.5
Boards: 96

Crystal_SMD_5032-4Pin_5.0x3.2mm

FP—

Crystal

SMD2520/4, Crystal, 5.0x3.2mm package, SMD, http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf

Pads: 4
SMD: 6.0×4.2
Boards: 95

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 94

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

Crystal_SMD_2012-2Pin_2.0x1.2mm

FP—

Crystal

2012/2, Crystal, 2.0x1.2mm package, SMD, http://txccrystal.com/images/pdf/9ht11.pdf

Pads: 2
SMD: 3.0×2.2
Boards: 85

QFN-44-1EP_7x7mm_P0.5mm_EP5.2x5.2mm

FP—

Package_DFN_QFN

QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17)

Pads: 45
SMD: 8.3×8.3
Boards: 85

TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85

TO-92L_HandSolder

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads: 3
THT: 5.5×5.1
Boards: 85