Footprints

158 footprints matching “SIL”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

158 footprints · page 5 of 7

Matched by name and keywords. Search by meaning instead

Gauge_10mm_Type3_SilkScreenTop

FP—

Calibration_Scale

Gauge, Massstab, 10mm, SilkScreenTop, Type 3,

Pads: —
Mount: exclude_from_pos_files
Boards: —

Gauge_10mm_Type4_SilkScreenTop

FP—

Calibration_Scale

Gauge, Massstab, 10mm, SilkScreenTop, Type 4,

Pads: —
Mount: exclude_from_pos_files
Boards: —

Gauge_50mm_Type2_SilkScreenTop

FP—

Calibration_Scale

Gauge, Massstab, 50mm, SilkScreenTop, Type 2,

Pads: —
Mount: exclude_from_pos_files
Boards: —

3M TEXTOOL ZIF SIL-20 220-2600-00-0602

FP—

celestial-altium-Connector_3M

Pads: 20
THT: 81.6×30.0
Boards: —

Tensility 54-00176

FP—

celestial-altium-Connector_TENSILITY

3.50mm (0.141", 1/8", Mini Plug) - Headphone Phone Jack Stereo (4 Conductor, TRRS) Connector Solder

Pads: 6
THT: 6.7×14.8
Boards: —

Tensility 54-00177

FP—

celestial-altium-Connector_TENSILITY

3.50mm (0.141", 1/8", Mini Plug) - Headphone Phone Jack Stereo (4 Conductor, TRRS) Connector Solder

Pads: 7
Mount: 9.1×14.8
Boards: —

INTERSIL SOIC-20 WIDE

FP—

celestial-altium-Leaded_SOIC

SOIC, 20-Leads, Body 12.80x7.50mm, Pitch 1.27mm, IPC Medium Density

Pads: 20
SMD: 11.8×13.5
Boards: —

INTERSIL SOIC-8 M8.15

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Pads: 8
SMD: 7.4×5.5
Boards: —

INTERSIL MSOP-8 M8.118

FP—

celestial-altium-Leaded_SOP

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

Pads: 8
SMD: 6.3×3.6
Boards: —

INTERSIL SSOP-20

FP—

celestial-altium-Leaded_SOP

SSOP, 20-Leads, Body 7.20x5.29mm, Pitch 0.65mm, IPC Medium Density

Pads: 20
SMD: 9.2×7.9
Boards: —

INTERSIL TSSOP-24 M24.173

FP—

celestial-altium-Leaded_SOP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, IPC Medium Density

Pads: 24
SMD: 7.8×8.4
Boards: —

INTERSIL TSSOP-28 M28.173

FP—

celestial-altium-Leaded_SOP

TSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, IPC Medium Density

Pads: 28
SMD: 7.8×10.3
Boards: —

SILICON LABS DFN-6 3x3MM

FP—

celestial-altium-Leadless_DFN

Temperature Sensor Digital - Local -40°C ~ 125°C, 6 Leads, Body 3x3mm, Package 6-VFDFN Exposed Pad

Pads: 7
SMD: 4.2×3.4
Boards: —

SILICON LABS QFN-28 5x5MM

FP—

celestial-altium-Leadless_QFN

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.35x3.35mm, IPC Medium Density

Pads: 29
SMD: 6.2×6.2
Boards: —

TI MicroSiP-8 SIL0008E

FP—

celestial-altium-Power_Module

MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density

Pads: 9
SMD: 4.4×4.1
Boards: —

Converter_DCDC_Silvertel_Ag54xx

FP—

Converter_DCDC

DCDC-Converter, 30W POE, Silvertel, pitch 2.54mm, package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf

Pads: 10
THT: 57.8×20.0
Boards: —

Converter_DCDC_TRACO_TOS06-05SIL_THT

FP—

Converter_DCDC

DCDC-Converter, TRACO, TOS06-05SIL, 6A, Rev. March 20. 2024, https://www.tracopower.com/products/tos06sil.pdf

Pads: 5
THT: 5.8×23.4
Boards: —

Converter_DCDC_TRACO_TOS06-12SIL_THT

FP—

Converter_DCDC

DCDC-Converter, TRACO, TOS06-12SIL, 6A, Rev. March 20. 2024, https://www.tracopower.com/products/tos06sil.pdf

Pads: 5
THT: 6.8×23.4
Boards: —

Osram_SFH2201

FP—

OptoDevice

PhotoDiode, Clear Silicone, Osram TOPLED, 4x5.09mm, area: 2.85x2.85mm, Orientation mark at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf

Pads: 2
SMD: 5.8×4.5
Boards: —