Footprints

719 footprints matching “Thermal”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

719 footprints · page 5 of 30

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VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 4

WQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44)

Pads: 17
SMD: 4.3×4.3
Boards: 4

WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29)

Pads: 21
SMD: 4.3×4.3
Boards: 4

LQFP-64-1EP_10x10mm_P0.5mm_EP5x5mm_ThermalVias

FP—

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf)

Pads: 65
SMD: 13.4×13.4
Boards: 4

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 4

LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_CSP

LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf)

Pads: 33
SMD: 6.2×6.2
Boards: 3

HVQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 3

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias

FP—

Package_DFN_QFN

http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf

Pads: 9
SMD: 2.7×2.5
Boards: 3

QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf)

Pads: 21
SMD: 4.8×4.8
Boards: 3

QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)

Pads: 21
SMD: 5.2×5.2
Boards: 3

QFN-24-1EP_4x4mm_P0.5mm_EP2.65x2.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 24 Pin (http://www.cypress.com/file/46236/download)

Pads: 25
SMD: 5.3×5.3
Boards: 3

QFN-24-1EP_4x4mm_P0.5mm_EP2.75x2.75mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.infineon.com/dgdl/Infineon-EZ-PD_BCR_Datasheet_USB_Type-C_Port_Controller_for_Power_Sinks-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ce9d70ad)

Pads: 25
SMD: 5.3×5.3
Boards: 3

QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)

Pads: 29
SMD: 5.2×5.2
Boards: 3

QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads: 33
SMD: 5.2×5.2
Boards: 3

QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)

Pads: 33
SMD: 5.2×5.2
Boards: 3