Footprints

609 footprints matching “Wired”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

609 footprints · page 5 of 26

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SolderWire-0.5sqmm_1x06_P4.8mm_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for 6 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 6
THT: 27.8×3.3
Boards: 2

SolderWire-0.75sqmm_1x02_P4.8mm_D1.25mm_OD2.3mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 8.6×17.5
Boards: 2

SolderWire-0.75sqmm_1x03_P7mm_D1.25mm_OD3.5mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 3
THT: 19.0×4.5
Boards: 2

SolderWire-0.75sqmm_1x04_P4.8mm_D1.25mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 4
THT: 18.2×3.6
Boards: 2

SolderWire-1.5sqmm_1x02_P6mm_D1.7mm_OD3mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 10.5×22.3
Boards: 2

SolderWire-1sqmm_1x02_P5.4mm_D1.4mm_OD2.7mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 1 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 1.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 9.6×20.2
Boards: 2

SolderWire-2.5sqmm_1x02_P8.8mm_D2.4mm_OD4.4mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 2
THT: 14.7×32.0
Boards: 2

SolderWire-6sqmm_1x01_D3.5mm_OD7mm

FP—

Connector_Wire

Soldered wire connection, for a single 6 mm² wire, reinforced insulation, conductor diameter 3.5mm, outer diameter 7mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 8.5×8.0
Boards: 2

SolderWirePad_1x01_SMD_2x4mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 2mm x 4mm

Pads: 1
SMD: 2.5×4.5
Boards: 2

L_Wuerth_HCI-7030

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-7030, 6.9x6.9x3.0mm, (https://www.we-online.com/components/products/datasheet/744310013.pdf)

Pads: 2
SMD: 8.3×7.4
Boards: 2

L_Wuerth_HCI-7040

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-7040, 6.9x6.9x3.8mm, (https://www.we-online.com/components/products/datasheet/744311022.pdf)

Pads: 2
SMD: 8.3×7.4
Boards: 2

TestPoint_Loop_D3.80mm_Drill2.5mm

FP3D

TestPoint

wire loop as test point, loop diameter 3.8mm, hole diameter 2.5mm

Pads: 1
THT: 5.0×5.0
Boards: 2

Molex_Micro-Latch_53253-0370_1x03_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0370 (compatible alternatives: 53253-0350), 3 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 3
THT: 9.0×4.7
Boards: 1

Molex_Micro-Latch_53253-0670_1x06_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0670 (compatible alternatives: 53253-0650), 6 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 6
THT: 15.0×4.7
Boards: 1

Molex_Micro-Latch_53253-0970_1x09_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0970 (compatible alternatives: 53253-0950), 9 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 9
THT: 21.0×4.7
Boards: 1

Molex_Micro-Latch_53253-1270_1x12_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-1270 (compatible alternatives: 53253-1250), 12 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 12
THT: 27.0×4.7
Boards: 1

Molex_Micro-Latch_53254-0270_1x02_P2.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53254-0270 (compatible alternatives: 53254-0250), 2 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 2
THT: 7.0×8.3
Boards: 1

Molex_Micro-Latch_53254-0770_1x07_P2.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53254-0770 (compatible alternatives: 53254-0750), 7 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads: 7
THT: 17.0×8.3
Boards: 1