Footprints
448 footprints matching “pd”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Relay_SPDT_HJR-4102
Relay_THT
IM Signal Relay SPDT HJR-4102
- Pads
- 6
- THT
- 10.4×14.7
- Boards
- 10
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
DIP-10_W7.62mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 10
- THT
- 9.7×13.2
- Boards
- 9
DIP-4_W10.16mm
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 4
- THT
- 12.3×5.6
- Boards
- 9
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
DIP-42_W15.24mm
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 42
- THT
- 17.3×53.9
- Boards
- 8
DIP-64_W22.86mm_Socket
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8
DIP-64_W22.86mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8
Relay_DPDT_AXICOM_IMSeries_Pitch5.08mm
Relay_THT
AXICOM IM-Series Relays, DPDR, Pitch 5.08
- Pads
- 8
- THT
- 7.0×10.5
- Boards
- 8
Relay_DPDT_Omron_G2RL-2
Relay_THT
Omron Relay, DPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf
- Pads
- 8
- THT
- 13.0×29.3
- Boards
- 8
Relay_SPDT_Omron_G2RL-1
Relay_THT
Omron Relay, SPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf
- Pads
- 5
- THT
- 13.0×29.3
- Boards
- 8
Relay_SPDT_Omron_G2RL-1-E
Relay_THT
Omron Relay, SPDT, High Capacity, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf
- Pads
- 5
- THT
- 13.0×29.3
- Boards
- 8
Relay_SPDT_Schrack-RT1-16A-FormC_RM5mm
Relay_THT
Relay SPST Schrack-RT1 RM5mm 16A 250V AC Form C http://image.schrack.com/datenblaetter/h_rt114012--_de.pdf
- Pads
- 5
- THT
- 29.9×13.6
- Boards
- 8
DIP-4_W7.62mm_SMDSocket_SmallPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 4
- SMD
- 10.7×5.7
- Boards
- 7
DIP-48_W15.24mm_Socket_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 48
- THT
- 18.3×61.6
- Boards
- 7
DIP-6_W7.62mm_Socket_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 6
- THT
- 10.7×8.2
- Boards
- 7
BatteryHolder_MPD_BA9VPC_1xPP3
Battery
1xPP3 (9V) battery holder, Memory Protection Devices P/N BA9VPC, http://www.memoryprotectiondevices.com/datasheets/BA9VPC-datasheet.pdf
- Pads
- 2
- THT
- 55.9×32.4
- Boards
- 6
SW_CK_JS202011AQN_DPDT_Angled
Button_Switch_THT
C&K sub miniature slide switch, JS series, DPDT, right angle, http://www.ckswitches.com/media/1422/js.pdf
- Pads
- 6
- THT
- 9.5×7.0
- Boards
- 6
Oscillator_SeikoEpson_SG-8002DC
Oscillator
8-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 4
- THT
- 9.8×14.0
- Boards
- 6
DIP-4_W7.62mm_Socket
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 4
- THT
- 10.7×5.7
- Boards
- 6
DIP-6_W10.16mm
Package_DIP
6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 6
- THT
- 12.3×8.1
- Boards
- 6
DIP-6_W7.62mm_SMDSocket_SmallPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 6
- SMD
- 10.7×8.2
- Boards
- 6
DIP-8_W10.16mm_LongPads
Package_DIP
8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 8
- THT
- 13.1×10.7
- Boards
- 6