Footprints

1,260 footprints matching “32”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,260 footprints · page 50 of 53

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Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm

FP—

Package_BGA

FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 325
SMD: 13.0×13.0
Boards: —

ST_TFBGA-320_11x11mm_Layout21x21_P0.5mm

FP—

Package_BGA

ST TFBGA-320, 11.0x11.0mm, 320 Ball, 21x21 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp131c.pdf

Pads: 320
SMD: 13.0×13.0
Boards: —

TFBGA-324_12x12mm_Layout18x18_P0.65mm

FP—

Package_BGA

TFBGA-324, NSMD, 12.0x12.0mm, 324 Ball, 18x18 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 324
SMD: 14.0×14.0
Boards: —

TFBGA-644_19x19mm_Layout28x28_P0.65mm

FP3D

Package_BGA

TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF

Pads: 644
SMD: 21.0×21.0
Boards: —

UFBGA-132_7x7mm_Layout12x12_P0.5mm

FP—

Package_BGA

UFBGA-132, 7.0x7.0mm, 132 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32l152zc.pdf#page=123

Pads: 132
SMD: 9.0×9.0
Boards: —

UFBGA-132_7x7mm_P0.5mm

FP—

Package_BGA

UFBGA 132 Pins, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf

Pads: 132
SMD: 9.0×9.0
Boards: —

UFBGA-32_4.0x4.0mm_Layout6x6_P0.5mm

FP—

Package_BGA

UFBGA-32, 6x6, 4x4mm package, pitch 0.5mm

Pads: 32
SMD: 6.0×6.0
Boards: —

Xilinx_CSGA324

FP—

Package_BGA

Spartan-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263

Pads: 324
SMD: 17.0×17.0
Boards: —

LFCSP-32-1EP_5x5mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP—

Package_CSP

LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/3416438741201015623cp_32_4.pdf)

Pads: 33
SMD: 6.2×6.2
Boards: —

ST_WLCSP-132_4.57x4.37mm_Layout12x11_P0.35mm

FP—

Package_CSP

ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf

Pads: 132
SMD: 6.6×6.4
Boards: —

ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59

Pads: 36
SMD: 4.8×5.0
Boards: —

ST_WLCSP-66_Die432

FP—

Package_CSP

WLCSP-66, 3.767x4.229mm, 66 Ball, 8x9 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f378vc.pdf#page=114

Pads: 66
SMD: 5.8×6.2
Boards: —

WLCSP-16_4x4_B2.17x2.32mm_P0.5mm

FP—

Package_CSP

WLCSP-16, http://www.nxp.com/documents/data_sheet/LPC1102_1104.pdf, http://www.nxp.com/assets/documents/data/en/application-notes/AN3846.pdf

Pads: 16
SMD: 3.9×3.9
Boards: —

CDFN-4_2.5x3.2mm_P2.1mm

FP—

Package_DFN_QFN

CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=16)

Pads: 4
SMD: 3.7×3.7
Boards: —

CDFN-4_3.2x5mm_P2.54mm

FP—

Package_DFN_QFN

CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=15)

Pads: 4
SMD: 4.4×5.5
Boards: —