Footprints

1,138 footprints matching “1EP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,138 footprints · page 7 of 48

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QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads: 33
SMD: 5.2×5.2
Boards: 9

QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)

Pads: 33
SMD: 6.3×6.3
Boards: 9

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 9

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 9

QFN-64-1EP_9x9mm_P0.5mm_EP4.7x4.7mm

FP—

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083))

Pads: 65
SMD: 10.2×10.2
Boards: 9

Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm

FP—

Package_DFN_QFN

Texas RGV0016A VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44)

Pads: 17
SMD: 5.3×5.3
Boards: 9

Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)

Pads: 21
SMD: 6.3×6.3
Boards: 9

Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)

Pads: 25
SMD: 5.3×5.3
Boards: 9

WQFN-16-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59)

Pads: 17
SMD: 5.3×5.3
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9

HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm

FP—

Package_SON

HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)

Pads: 9
SMD: 4.3×3.5
Boards: 9

WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm

FP3D

Package_SON

WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)

Pads: 11
SMD: 3.3×3.5
Boards: 9

Allegro_QFN-12-10-1EP_3x3mm_P0.5mm

FP—

Sensor_Current

Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)

Pads: 10
SMD: 4.2×4.3
Boards: 9