Footprints

1,138 footprints matching “1EP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,138 footprints · page 8 of 48

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WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm

FP3D

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads: 9
SMD: 5.2×3.5
Boards: 8

WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm

FP3D

Package_DFN_QFN

http://www.onsemi.com/pub/Collateral/510CD.PDF

Pads: 21
SMD: 4.0×6.0
Boards: 8

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 8

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm

FP—

Package_SO

MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)

Pads: 11
SMD: 6.3×3.5
Boards: 8

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 8

Crystal_HC49-U_Horizontal_1EP_style2

FP3D

Crystal

HC-49/U, Crystal, length 13.0mm, width 10.9mm, THT, http://5hertz.com/pdfs/04404_D.pdf

Pads: 3
THT: 13.5×17.8
Boards: 7

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 7

QFN-24-1EP_4x4mm_P0.5mm_EP2.75x2.75mm

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.infineon.com/dgdl/Infineon-EZ-PD_BCR_Datasheet_USB_Type-C_Port_Controller_for_Power_Sinks-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ce9d70ad)

Pads: 25
SMD: 5.3×5.3
Boards: 7

QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)

Pads: 33
SMD: 6.3×6.3
Boards: 7

QFN-64-1EP_9x9mm_P0.5mm_EP7.65x7.65mm

FP—

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-2549-8-bit-AVR-Microcontroller-ATmega640-1280-1281-2560-2561_datasheet.pdf (page 415))

Pads: 65
SMD: 10.3×10.3
Boards: 7

Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)

Pads: 25
SMD: 5.3×5.3
Boards: 7

TQFN-20-1EP_5x5mm_P0.65mm_EP3.25x3.25mm

FP—

Package_DFN_QFN

TQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5))

Pads: 21
SMD: 6.2×6.2
Boards: 7

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 7

VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP—

Package_DFN_QFN

VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 7

WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)

Pads: 17
SMD: 4.3×4.3
Boards: 7

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm

FP—

Package_SO

HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 7