Footprints

174 footprints matching “FBGA”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

174 footprints · page 8 of 8

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VFBGA-86_6x6mm_Layout10x10_P0.55mm

FP—

Package_BGA

VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740

Pads: 86
SMD: 8.0×8.0
Boards: —

XFBGA-121_8x8mm_Layout11x11_P0.65mm

FP—

Package_BGA

XFBGA-121, https://www.nxp.com/docs/en/package-information/SOT1533-1.pdf

Pads: 121
SMD: 10.2×10.2
Boards: —

XFBGA-36_3.5x3.5mm_Layout6x6_P0.5mm

FP—

Package_BGA

XFBGA-36, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf

Pads: 36
SMD: 5.7×5.7
Boards: —

XFBGA-64_5.0x5.0mm_Layout8x8_P0.5mm

FP—

Package_BGA

XFBGA-64, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf

Pads: 64
SMD: 7.0×7.0
Boards: —

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads: 6
SMD: 3.5×3.1
Boards: —

WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD

FP—

Package_CSP

WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf

Pads: 8
SMD: 3.6×3.7
Boards: —