Footprints

1,225 footprints matching “6mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,225 footprints · page 9 of 52

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PinHeader_1x16_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x16, 2.54mm pitch, 6mm pin length, single row

Pads: 16
THT: 12.3×41.6
Boards: 10

PinHeader_1x18_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x18, 2.54mm pitch, 6mm pin length, single row

Pads: 18
THT: 12.3×46.7
Boards: 10

MountingHole_6mm_Pad

FP—

MountingHole

Mounting Hole 6mm, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 12.5×12.5
Boards: 10

AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)

Pads: 5
SMD: 6.7×5.7
Boards: 10

DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm

FP3D

Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: 10

DIP-16_W10.16mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 16
THT: 12.3×20.8
Boards: 10

SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm

FP—

Package_SON

SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf)

Pads: 9
SMD: 3.6×2.5
Boards: 10

R_Axial_DIN0617_L17.0mm_D6.0mm_P25.40mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0617 series, Axial, Horizontal, pin pitch=25.4mm, 2W, length*diameter=17*6mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf

Pads: 2
THT: 28.3×6.5
Boards: 10

TerminalBlock_MetzConnect_Type094_RT03502HBLU_1x02_P5.00mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type094_RT03502HBLU, 2 pins, pitch 5mm, size 10x8.3mm, drill diameter 1.3mm, pad diameter 2.6mm, https://www.metz-connect.com/externalfiles/310941/863441.PDF

Pads: 2
THT: 11.0×9.3
Boards: 10

SW_PUSH_1P1T_6x3.5mm_H5.0_APEM_MJTP1250

FP3D

Button_Switch_THT

tactile push button, 6x3.5mm, https://www.apem.com/idec-apem/en_US/PCB-switches/Tactile-Switches/MJTP-6mm-through-hole/c/MJTP_6mm_through%20hole?page=1

Pads: 2
THT: 9.3×4.0
Boards: 9

CP_Radial_D10.0mm_P5.00mm_P7.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=5.00mm 7.50mm, diameter=10mm, height=16mm, Electrolytic Capacitor

Pads: 2
THT: 11.0×11.0
Boards: 9

JST_VH_B2P-VH-FB-B_1x02_P3.96mm_Vertical

FP—

Connector_JST

JST VH series connector, B2P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads: 2
THT: 10.8×10.7
Boards: 9

JWT_A3963_1x02_P3.96mm_Vertical

FP—

Connector

JWT A3963, 3.96mm pitch Pin head connector (http://www.jwt.com.tw/pro_pdf/A3963.pdf)

Pads: 2
THT: 8.8×8.6
Boards: 9

D_DO-34_SOD68_P2.54mm_Vertical_AnodeUp

FP—

Diode_THT

Diode, DO-34_SOD68 series, Axial, Vertical, pin pitch=2.54mm, length*diameter=3.04*1.6mm^2, https://www.nxp.com/docs/en/data-sheet/KTY83_SER.pdf

Pads: 2
THT: 4.6×2.1
Boards: 9

D_T-1_P10.16mm_Horizontal

FP3D

Diode_THT

Diode, T-1 series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf

Pads: 2
THT: 12.7×3.1
Boards: 9

LED_SideEmitter_Rectangular_W4.5mm_H1.6mm

FP3D

LED_THT

LED, Side Emitter, Rectangular, size 4.5x1.6mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED15MMGE_LED15MMGN%23KIN.pdf, generated by kicad-footprint-generator

Pads: 2
THT: 5.1×2.3
Boards: 9

WLCSP-12_1.56x1.56mm_P0.4mm

FP—

Package_CSP

WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf

Pads: 12
SMD: 2.1×2.1
Boards: 9

HVQFN-40-1EP_6x6mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 40 Pin (https://www.nxp.com/docs/en/package-information/SOT618-1.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: 9

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 9

WQFN-16-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59)

Pads: 17
SMD: 5.3×5.3
Boards: 9

DIP-4_W10.16mm

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 4
THT: 12.3×5.6
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9