Footprints

610 footprints matching “Micro”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

610 footprints · page 9 of 26

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MICRON 96-Ball FBGA - x16 TW

FP—

celestial-altium-Leadless_BGA

BGA, 96-Leads, Body 8.00x14.00mmx1.20mm, Pitch 0.80mm

Pads: 96
SMD: 8.4×14.5
Boards: —

MICRON FBGA-96 x16 KD

FP—

celestial-altium-Leadless_BGA

FBGA, 96-Leads, Body 9.00x13.00mmx1.20mm, Pitch 0.80mm

Pads: 96
SMD: 9.6×13.5
Boards: —

MICRON FBGA-96 x16 RC

FP—

celestial-altium-Leadless_BGA

FBGA, 96-Leads, Body 10.00x13.00mmx1.20mm, Pitch 0.80mm

Pads: 96
SMD: 10.5×13.5
Boards: —

MICRON FBGA-96 x16 TB

FP—

celestial-altium-Leadless_BGA

FBGA, 96-Leads, Body 7.50x13.00mmx1.20mm, Pitch 0.80mm

Pads: 96
SMD: 8.2×13.5
Boards: —

MICRON VFBGA-90 8X13MM

FP—

celestial-altium-Leadless_BGA

BGA, 90-Leads, Body 8.00x13.00mmx1.00mm, Pitch 0.80mm

Pads: 90
SMD: 8.4×13.4
Boards: —

STMICRO UFBGA169 7X7

FP—

celestial-altium-Leadless_BGA

UFBGA, 169-Leads, Body 7.00x7.00mmx0.60mm, Pitch 0.50mm

Pads: 169
SMD: 7.6×7.6
Boards: —

STMICROELECTRONICS UFBGA176+25 10X10 A0E7

FP—

celestial-altium-Leadless_BGA

BGA, 176+25-Leads, Body 10.00x10.00mmx0.60mm, Pitch 0.65mm

Pads: 201
SMD: 10.5×10.5
Boards: —

MICROCHIP DFN-10 3mmx3mm MF

FP—

celestial-altium-Leadless_DFN

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.34mm, IPC Medium Density

Pads: 11
SMD: 4.2×4.2
Boards: —

MICROCHIP DFN-8 3X3MM

FP—

celestial-altium-Leadless_DFN

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.50x2.0mm, IPC Medium Density

Pads: 9
SMD: 4.2×3.4
Boards: —

MICROCHIP TDFN-8 2X3MM

FP—

celestial-altium-Leadless_DFN

DFN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

Pads: 9
SMD: 4.2×2.4
Boards: —

MICROCHIP UDFN-8 Q4B

FP—

celestial-altium-Leadless_DFN

UDFN, 8-Leads, Body 3.00x2.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.60mm

Pads: 9
SMD: 4.2×2.4
Boards: —

MICRON VDFPN-8 (MLP8) (8x6) F8

FP—

celestial-altium-Leadless_DFN

V-PDFN-8 8mm x 6mm (MLP8) Package Code: F8, 8-Leads, Body 8.00x6.00mm, Pitch 1.27mm, Thermal Pad 5.16x4.80mm, IPC Medium Density

Pads: 9
SMD: 9.0×6.4
Boards: —

MICROCHIP LQFP-144 20X20

FP—

celestial-altium-Leadless_LQFP

LQFP, 144-Leads, Body 20.00x20.00mm, Pitch 0.50mm, IPC Medium Density

Pads: 144
SMD: 23.2×23.2
Boards: —

MICROCHIP 32QFN-3304-5x5B

FP—

celestial-altium-Leadless_QFN

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.30x3.30mm, IPC Medium Density

Pads: 33
SMD: 5.8×5.8
Boards: —

MICROCHIP QFN-20 4x4MM

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.50x2.50mm, IPC Medium Density

Pads: 21
SMD: 5.2×5.2
Boards: —

MICROCHIP QFN-24 4x4

FP—

celestial-altium-Leadless_QFN

QFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.50x2.50mm, IPC Medium Density

Pads: 25
SMD: 4.6×4.6
Boards: —

MICROCHIP SMSC SQFN-32 5x5MM

FP—

celestial-altium-Leadless_QFN

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.30x3.30mm, IPC Medium Density

Pads: 33
SMD: 6.1×6.1
Boards: —

MICROCHIP VQFN-20 3X3 REB

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

Pads: 21
SMD: 4.2×4.2
Boards: —

STMicro VFQFPN-36 6X6MM

FP—

celestial-altium-Leadless_QFN

QFN, 36-Leads, Body 6.00x6.00mm, Pitch 0.45mm/0.55mm, Thermal Pad 4.10x4.10mm, IPC Medium Density

Pads: 37
SMD: 6.8×6.8
Boards: —

MICROCHIP WSON-8 6x5mm

FP—

celestial-altium-Leadless_SON

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Pads: 9
SMD: 7.2×5.6
Boards: —

TI MICROSIP-15 SIT0015A

FP—

celestial-altium-Power_Module

MicroSIP, 15-Leads, Body 3.50x3.50mm

Pads: 15
SMD: 4.2×4.1
Boards: —

TI MicroSiP-8 SIL0008E

FP—

celestial-altium-Power_Module

MicroSIP, 8-Leads, Body 3.50x3.50mm, Pitch 0.80mm, Thermal Pad 0.00x0.00mm, IPC Medium Density

Pads: 9
SMD: 4.4×4.1
Boards: —

SD-SIM_microSD-microSIM_Molex_104168-1620

FP—

Connector_Card

microSD and microSIM connector, https://www.molex.com/pdm_docs/sd/1041681620_sd.pdf

Pads: 18
SMD: 15.9×19.3
Boards: —

Molex_Micro-Fit_3.0_43045-0210_2x01-1MP_P3.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Fit 3.0 Connector System, 43045-0210 (compatible alternatives: 43045-0211, 43045-0209), 1 Pins per row (http://www.molex.com/pdm_docs/sd/430450210_sd.pdf)

Pads: 3
SMD: 12.2×17.2
Boards: —