Footprints
201 footprints matching “SB”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_DSBGA-6_0.76x1.16mm_Layout2x3_P0.4mm
Package_BGA
Texas Instruments YFP0006, DSBGA-6, 0.76x1.16mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/ts5a12301e.pdf#page=23
- Pads
- 6
- SMD
- 2.8×3.2
- Boards
- —
Texas_DSBGA-6_0.855x1.255mm_Layout2x3_P0.4mm_LevelB
Package_BGA
Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf
- Pads
- 6
- SMD
- 2.9×3.3
- Boards
- —
Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 64
- SMD
- 5.4×5.5
- Boards
- —
Texas_DSBGA-8_1.5195x1.5195mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZR pad definition, 1.5195x1.5195mm, 8 Ball, 3x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf
- Pads
- 8
- SMD
- 3.5×3.5
- Boards
- —
Texas_YFP0020_DSBGA-20_1.588x1.988mm_Layout4x5_P0.4mm
Package_BGA
Texas Instruments, YFP0020, DSBGA-20, area grid, 1.588x1.988mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ds/symlink/txs0206.pdf
- Pads
- 20
- SMD
- 3.6×4.0
- Boards
- —
Xilinx_SBG484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_SBG485
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm
Package_CSP
ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23
- Pads
- 6
- SMD
- 3.5×3.1
- Boards
- —
DirectFET_SB
Package_DirectFET
DirectFET SB https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=23
- Pads
- 3
- SMD
- 6.3×4.3
- Boards
- —