Footprints
1,343 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LQFP-48_7x7mm_P0.5mm
Package_QFP
LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 862
LQFP-64_10x10mm_P0.5mm
Package_QFP
LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)
- Pads
- 64
- SMD
- 13.4×13.4
- Boards
- 663
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
NetTie-2_SMD_Pad0.5mm
NetTie
Net tie, 2 pin, 0.5mm square SMD pads
- Pads
- 2
- SMD
- smd
- Boards
- 309
LQFP-100_14x14mm_P0.5mm
Package_QFP
LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)
- Pads
- 100
- SMD
- 17.5×17.5
- Boards
- 273
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm
Package_DFN_QFN
QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 245
R_Axial_DIN0309_L9.0mm_D3.2mm_P12.70mm_Horizontal
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=12.7mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 14.8×3.7
- Boards
- 230
TestPoint_THTPad_D1.0mm_Drill0.5mm
TestPoint
THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm
- Pads
- 1
- THT
- 2.0×2.0
- Boards
- 204
QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm
Package_DFN_QFN
QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 176
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
Fiducial_0.5mm_Mask1mm
Fiducial
Fiducial, circular marking, 0.5mm bare copper, 1mm soldermask opening (Level C)
- Pads
- —
- SMD
- 1.5×1.5
- Boards
- 161
CP_Elec_10x10.5
Capacitor_SMD
SMD capacitor, aluminum electrolytic, Vishay 1010, 10.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf
- Pads
- 2
- SMD
- 13.3×11.0
- Boards
- 157
VSSOP-8_2.3x2mm_P0.5mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 4.6×2.5
- Boards
- 156
TSSOP-10_3x3mm_P0.5mm
Package_SO
TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)
- Pads
- 10
- SMD
- 6.3×3.5
- Boards
- 153
InvenSense_QFN-24_4x4mm_P0.5mm
Sensor_Motion
24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 5.3×5.3
- Boards
- 136
TestPoint_THTPad_1.0x1.0mm_Drill0.5mm
TestPoint
THT rectangular pad as test Point, square 1.0mm side length, hole diameter 0.5mm
- Pads
- 1
- THT
- 2.0×2.0
- Boards
- 124
LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)
- Pads
- 14
- SMD
- 3.5×3.0
- Boards
- 118
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
LGA-12_2x2mm_P0.5mm
Package_LGA
LGA12
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- 115
Converter_DCDC_RECOM_R-78E-0.5_THT
Converter_DCDC
DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf
- Pads
- 3
- THT
- 12.1×9.0
- Boards
- 111
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
CP_Elec_8x10.5
Capacitor_SMD
SMD capacitor, aluminum electrolytic, Vishay 0810, 8.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf
- Pads
- 2
- SMD
- 12.3×9.0
- Boards
- 102
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93