Footprints
17 footprints matching “0.635”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
PQFP-132_24x24mm_P0.635mm_i386
Package_QFP
PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)
- Pads
- 132
- SMD
- 28.9×28.9
- Boards
- 5
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
QSOP-28_3.9x9.9mm_P0.635mm
Package_SO
QSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 28
- SMD
- 7.4×10.4
- Boards
- 4
QSOP-20_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 20
- SMD
- 7.4×9.2
- Boards
- 3
PQFP-132_24x24mm_P0.635mm
Package_QFP
PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)
- Pads
- 132
- SMD
- 28.9×28.9
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm_ThermalVias
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
TE_5767171-1_2x19_P0.635mm_Vertical
Connector_TE-Connectivity
PCB Mount Receptacle, Vertical, Board-to-Board, 38 Position, 24.003mm / .64mm [.945in] Centerline, Header Only, Palladium Nickel (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F5767171%7FB2%7Fpdf%7FEnglish%7FENG_CD_5767171_B2.pdf%7F5767171-1#page=2)
- Pads
- 39
- SMD
- 9.3×26.4
- Boards
- —
HTSSOP-44_6.1x14mm_P0.635mm_TopEP4.14x7.01mm
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38)
- Pads
- 44
- SMD
- 9.5×14.5
- Boards
- —
Allegro_QSOP-24_3.9x8.7mm_P0.635mm
Sensor_Current
Allegro Microsystems 24-Lead Plastic Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en)
- Pads
- 24
- SMD
- 7.8×9.2
- Boards
- —