Footprints
13 footprints matching “100-ball”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TFBGA-100_8x8mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199
- Pads
- 100
- SMD
- 10.0×10.0
- Boards
- 8
LFBGA-100_10x10mm_Layout10x10_P0.8mm
Package_BGA
LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87
- Pads
- 100
- SMD
- 12.0×12.0
- Boards
- 1
BGA-100_12x18mm_Layout10x17_P1mm
Package_BGA
BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 100
- SMD
- 14.0×20.0
- Boards
- —
BGA-100_14x18mm_Layout10x17_P1mm
Package_BGA
BGA-100, 14x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 100
- SMD
- 16.0×20.0
- Boards
- —
TFBGA-100_5.5x5.5mm_Layout10x10_P0.5mm
Package_BGA
TFBGA-100, NSMD, 5.5x5.5mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 100
- SMD
- 7.5×7.5
- Boards
- —
UFBGA-100_7x7mm_Layout12x12_P0.5mm
Package_BGA
UFBGA-100, 7.0x7.0mm, 100 Ball, 12x12 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=93
- Pads
- 100
- SMD
- 9.0×9.0
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-100_Die422
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f302vc.pdf#page=133
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die446
Package_CSP
WLCSP-100, 4.775x5.041mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f303zd.pdf#page=162
- Pads
- 100
- SMD
- 6.8×7.1
- Boards
- —
ST_WLCSP-100_Die452
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00330506.pdf#page=218
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die461
Package_CSP
WLCSP-100, 4.618x4.142mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00284211.pdf#page=259
- Pads
- 100
- SMD
- 6.6×6.2
- Boards
- —