Footprints

844 footprints matching “24”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

844 footprints · page 1 of 36

Matched by name and keywords. Search by meaning instead

DIP-40_W15.24mm

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 40
THT: 17.3×51.3
Boards: 272

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 256

TSSOP-24_4.4x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×8.3
Boards: 242

DIP-40_W15.24mm_Socket

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 40
THT: 18.3×51.4
Boards: 179

DIP-28_W15.24mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 28
THT: 17.3×36.1
Boards: 172

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136

DIP-28_W15.24mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 28
THT: 18.3×36.2
Boards: 133

D_DO-201AD_P15.24mm_Horizontal

FP3D

Diode_THT

Diode, DO-201AD series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=9.5*5.2mm^2, http://www.diodes.com/_files/packages/DO-201AD.pdf

Pads: 2
THT: 18.9×5.7
Boards: 131

SSOP-24_5.3x8.2mm_P0.65mm

FP3D

Package_SO

SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)

Pads: 24
SMD: 9.4×8.7
Boards: 111

USB_B_Lumberg_2411_02_Horizontal

FP—

Connector_USB

USB 2.0 receptacle type B, horizontal version, through-hole, https://downloads.lumberg.com/datenblaetter/en/2411_02.pdf

Pads: 5
THT: 17.4×17.0
Boards: 99

DIP-40_W15.24mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 40
THT: 18.3×51.4
Boards: 99

USB_Mini-B_Lumberg_2486_01_Horizontal

FP3D

Connector_USB

USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf

Pads: 6
SMD: 11.9×10.6
Boards: 96

R_Axial_DIN0207_L6.3mm_D2.5mm_P15.24mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0207 series, Axial, Horizontal, pin pitch=15.24mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 17.3×3.0
Boards: 90

DIP-32_W15.24mm

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 32
THT: 17.3×41.2
Boards: 82

DIP-24_W15.24mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 24
THT: 17.3×31.0
Boards: 80

Buzzer_TDK_PS1240P02BT_D12.2mm_H6.5mm

FP3D

Buzzer_Beeper

Buzzer, D12.2mm height 6.5mm, https://product.tdk.com/info/en/catalog/datasheets/piezoelectronic_buzzer_ps_en.pdf

Pads: 2
THT: 12.7×12.7
Boards: 79

DIP-32_W15.24mm_Socket

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 32
THT: 18.3×41.3
Boards: 75

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

nRF24L01_Breakout

FP—

RF_Module

nRF24L01 breakout board

Pads: 8
THT: 29.5×15.8
Boards: 72

R_Axial_DIN0309_L9.0mm_D3.2mm_P15.24mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=15.24mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 17.3×3.7
Boards: 64