Footprints
250 footprints matching “35mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
R_2512_6332Metric_Pad1.40x3.35mm_HandSolder
Resistor_SMD
Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 189
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
CP_Radial_D18.0mm_P7.50mm
Capacitor_THT
CP, Radial series, Radial, pin pitch=7.50mm, diameter=18mm, height=35mm, Electrolytic Capacitor
- Pads
- 2
- THT
- 18.5×18.5
- Boards
- 82
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm
Package_DFN_QFN
QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- 18
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
CP_Radial_D35.0mm_P10.00mm_SnapIn
Capacitor_THT
CP, Radial series, Radial, pin pitch=10.00mm, diameter=35mm, height=50mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf
- Pads
- 2
- THT
- 35.5×35.5
- Boards
- 12
LED_D3.0mm_Horizontal_O6.35mm_Z10.0mm
LED_THT
LED, diameter 3.0mm, horizontal offset 6.35mm, z-position of LED center 10.0mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.0×13.2
- Boards
- 11
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
Jack_6.35mm_Neutrik_NJ3FD-V_Vertical
Connector_Audio
6.35mm (1/4 in) Vertical Jack, Non-switching stereo jack (T/R/S), https://www.neutrik.com/en/product/nj3fd-v
- Pads
- 3
- THT
- 15.5×16.0
- Boards
- 9
Jack_6.35mm_Neutrik_NMJ6HFD2_Horizontal
Connector_Audio
M Series, 6.35mm (1/4in) stereo jack, switched, with full threaded nose and straight PCB pins, https://www.neutrik.com/en/product/nmj6hfd2
- Pads
- 6
- THT
- 33.9×20.2
- Boards
- 9
D_2512_6332Metric_Pad1.52x3.35mm_HandSolder
Diode_SMD
Diode SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 9
Fuse_2512_6332Metric_Pad1.52x3.35mm_HandSolder
Fuse
Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 9
Heatsink_Fischer_SK104-STC-STIC_35x13mm_2xDrill2.5mm
Heatsink
Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC,
- Pads
- 1
- THT
- 35.5×13.5
- Boards
- 9
Heatsink_Fischer_SK104-STCB_35x13mm__2xDrill3.5mm_ScrewM3
Heatsink
Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC,
- Pads
- 1
- THT
- 35.5×13.5
- Boards
- 9
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm
Package_DFN_QFN
DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf)
- Pads
- 7
- SMD
- 4.2×2.5
- Boards
- 8
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 8