Footprints

13 footprints matching “36-ball”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

13 footprints

Matched by name and keywords. Search by meaning instead

Alliance_TFBGA-36_6x8mm_Layout6x8_P0.75mm

FP—

Package_BGA

Alliance TFBGA-36, NSMD, 6.0x8.0mm, 36 Ball, 6x8 Layout, 0.75mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/AS6C1008_Mar_2023V1.2.pdf#page=13

Pads: 36
SMD: 8.0×10.0
Boards: —

ST_uTFBGA-36_3.6x3.6mm_Layout6x6_P0.5mm

FP—

Package_BGA

ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf

Pads: 36
SMD: 5.6×5.6
Boards: —

TFBGA-644_19x19mm_Layout28x28_P0.65mm

FP3D

Package_BGA

TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF

Pads: 644
SMD: 21.0×21.0
Boards: —

UCBGA-36_2.5x2.5mm_Layout6x6_P0.4mm

FP3D

Package_BGA

UCBGA-36, 2.5x2.5mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213

Pads: 36
SMD: 4.5×4.5
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Pads: 36
SMD: 8.1×8.1
Boards: —

ST_WLCSP-36_2.58x3.07mm_Layout6x6_P0.4mm

FP—

Package_CSP

ST WLCSP-36, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf

Pads: 36
SMD: 4.6×5.1
Boards: —

ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55

Pads: 36
SMD: 4.7×4.6
Boards: —

ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59

Pads: 36
SMD: 4.8×5.0
Boards: —