Footprints
157 footprints matching “3x1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
C_1206_3216Metric_Pad1.33x1.80mm_HandSolder
Capacitor_SMD
Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 5.0×2.3
- Boards
- 1,130
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
SOIC-16W_5.3x10.2mm_P1.27mm
Package_SO
SOIC, 16 Pin (http://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 57
DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm
Package_DFN_QFN
DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 47
TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- 38
SO-20_5.3x12.6mm_P1.27mm
Package_SO
SO, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 20
- SMD
- 9.4×13.1
- Boards
- 35
SO-14_5.3x10.2mm_P1.27mm
Package_SO
SO, 14 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 14
- SMD
- 9.4×10.7
- Boards
- 30
TerminalBlock_Phoenix_MKDS-3-4-5.08_1x04_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-3-4-5.08, 4 pins, pitch 5.08mm, size 20.3x11.2mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/2138224.pdf
- Pads
- 4
- THT
- 21.3×12.2
- Boards
- 23
SO-24_5.3x15mm_P1.27mm
Package_SO
SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 24
- SMD
- 9.4×15.5
- Boards
- 19
SO-16_5.3x10.2mm_P1.27mm
Package_SO
SO, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 17
RotaryEncoder_Bourns_Vertical_PEC12R-3x17F-Sxxxx
Rotary_Encoder
Bourns rotary encoder, PEC12R, with switch, with bushing, vertical shaft, 17.5mm shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf
- Pads
- 6
- THT
- 16.6×14.7
- Boards
- 17
BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm
Package_BGA
BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf
- Pads
- 96
- SMD
- 11.0×15.0
- Boards
- 15
MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm
Package_SO
MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 8
TerminalBlock_WAGO_236-402_1x02_P5.00mm_45Degree
TerminalBlock_WAGO
Terminal Block WAGO 236-402, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 12.3x14mm, drill diameter 1.15mm, pad diameter 3mm,
- Pads
- 2
- THT
- 13.3×15.0
- Boards
- 7
LED_Kingbright_APFA3010_3x1.5mm_Horizontal
LED_SMD
LED RGB, APFA3010, http://www.kingbrightusa.com/images/catalog/SPEC/APFA3010LSEEZGKQBKC.pdf
- Pads
- 4
- SMD
- 4.5×2.6
- Boards
- 6
C_0504_1310Metric_Pad0.83x1.28mm_HandSolder
Capacitor_SMD
Capacitor SMD 0504 (1310 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 2.4×1.6
- Boards
- 5
TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm
Package_DFN_QFN
TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- 4
TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm_ThermalVias
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- 4
TerminalBlock_WAGO_236-102_1x02_P5.00mm_45Degree
TerminalBlock_WAGO
Terminal Block WAGO 236-102, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 12.3x14mm, drill diameter 1.15mm, pad diameter 3mm,
- Pads
- 2
- THT
- 13.3×15.0
- Boards
- 4
Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 3.4×3.4
- Boards
- 3
DFN-6_1.3x1.2mm_P0.4mm
Package_DFN_QFN
6-Lead Plastic DFN (1.3mm x 1.2mm)
- Pads
- 6
- SMD
- 1.6×1.4
- Boards
- 3
UQFN-10_1.3x1.8mm_P0.4mm
Package_DFN_QFN
UQFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9))
- Pads
- 10
- SMD
- 2.5×3.0
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
SSOP-48_5.3x12.8mm_P0.5mm
Package_SO
SSOP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/05081887_A_G48.pdf)
- Pads
- 48
- SMD
- 9.4×13.3
- Boards
- 3