Footprints

284 footprints matching “3x3mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

284 footprints · page 1 of 12

Matched by name and keywords. Search by meaning instead

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads: 8
SMD: 6.4×3.5
Boards: 348

MSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)

Pads: 10
SMD: 6.2×3.5
Boards: 333

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads: 21
SMD: 4.3×4.3
Boards: 83

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y

FP3D

Package_LGA

LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)

Pads: 16
SMD: 3.5×3.5
Boards: 61

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 51

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 47

Texas_DRC0010J_ThermalVias

FP—

Package_SON

Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf

Pads: 11
SMD: 3.9×3.9
Boards: 45

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 44

TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm

FP—

Package_DFN_QFN

TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)

Pads: 17
SMD: 4.2×4.2
Boards: 38

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads: 8
SMD: 3.5×3.5
Boards: 38

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf)

Pads: 7
SMD: 4.2×3.5
Boards: 31

VSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 6.4×3.5
Boards: 29

MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)

Pads: 11
SMD: 6.3×3.5
Boards: 28

LGA-16_3x3mm_P0.5mm

FP3D

Package_LGA

http://www.memsic.com/userfiles/files/DataSheets/Magnetic-Sensors-Datasheets/MMC5883MA-RevC.pdf

Pads: 16
SMD: 3.5×3.5
Boards: 26

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads: 9
SMD: 4.0×3.6
Boards: 23

Texas_S-PVSON-N10_ThermalVias

FP3D

Package_SON

3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 21

QFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm

FP—

Package_DFN_QFN

QFN, 16 Pin (https://www.onsemi.com/pub/Collateral/NCN4555-D.PDF)

Pads: 17
SMD: 4.2×4.2
Boards: 20

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm

FP3D

Package_DFN_QFN

DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)

Pads: 11
SMD: 4.3×3.5
Boards: 17