Footprints
17 footprints matching “8.7mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-14_3.9x8.7mm_P1.27mm
Package_SO
SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 908
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
L_Radial_D8.7mm_P5.00mm_Fastron_07HCP
Inductor_THT
Inductor, Radial series, Radial, pin pitch=5.00mm, diameter=8.7mm, height=10mm, Fastron, 07HCP, http://cdn-reichelt.de/documents/datenblatt/B400/DS_07HCP.pdf
- Pads
- 2
- THT
- 9.2×9.2
- Boards
- 44
SOIC-28W_7.5x18.7mm_P1.27mm
Package_SO
SOIC, 28 Pin (https://www.es.co.th/Schemetic/PDF/AK5394A.PDF#page=23)
- Pads
- 28
- SMD
- 11.9×19.2
- Boards
- 40
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
Fuse_BelFuse_0ZRE0100FF_L18.7mm_W5.1mm
Fuse
Fuse 0ZRE0100FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 19.2×5.6
- Boards
- 4
QSOP-20_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 20
- SMD
- 7.4×9.2
- Boards
- 3
C_Rect_L16.5mm_W8.7mm_P15.00mm_MKT
Capacitor_THT
C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*8.7mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf
- Pads
- 2
- THT
- 17.7×9.2
- Boards
- 2
EQFP-144-1EP_20x20mm_P0.5mm_EP8.93x8.7mm
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- 2
CAP ALSMD ELEC 6.6MM H8.7MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 6.60mm Land Size, 6.30mm Diameter, 8.70mm Height, 8.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 10.1×7.0
- Boards
- —
CAP ALSMD POLY 8.3MM H8.7MM
celestial-altium-Capacitor_Aluminium
Aluminum Electrolytic Capacitor, Body 8.30x8.30x8.7mm
- Pads
- 2
- SMD
- 12.0×8.8
- Boards
- —
Oscillator_SMD_SeikoEpson_SG8002JA-4Pin_14.0x8.7mm
Oscillator
Seiko Epson SG-8002JA, Crystal Oscillator, 14.0x8.7mm package, SMD, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC
- Pads
- 4
- SMD
- 15.0×12.3
- Boards
- —
Oscillator_SMD_SeikoEpson_SG8002JA-4Pin_14.0x8.7mm_HandSoldering
Oscillator
Seiko Epson SG-8002JA, Crystal Oscillator, 14.0x8.7mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC
- Pads
- 4
- SMD
- 15.0×15.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP8.93x8.7mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
Allegro_QSOP-24_3.9x8.7mm_P0.635mm
Sensor_Current
Allegro Microsystems 24-Lead Plastic Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en)
- Pads
- 24
- SMD
- 7.8×9.2
- Boards
- —
DIP_Socket-40_W22.1mm_W22.86mm_W25.4mm_W27.94mm_W28.7mm_3M_240-3639-00-0602J
Socket
3M 40-pin zero insertion force socket, through-hole, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
- Pads
- 40
- THT
- 35.2×78.8
- Boards
- —