Footprints

83 footprints matching “ABS”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

83 footprints · page 1 of 4

Matched by name and keywords. Search by meaning instead

ABS07-32.768KHZ-T

FP—

kiml-00-kiml-unsorted

Pads: 2
SMD: 4.2×2.4
Boards: —

SOT-23

FP3D

Package_TO_SOT_SMD

SOT, 3 Pin (JEDEC TO-236 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=TO-236)

Pads: 3
SMD: 3.9×3.4
Boards: 5,749

SOT-23-6

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (JEDEC MO-178 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads: 6
SMD: 4.1×3.4
Boards: 2,266

SOT-363_SC-70-6

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=170, JEDEC MO-203, variant AB, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)

Pads: 6
SMD: 2.9×2.2
Boards: 586

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

TSSOP-14_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 14
SMD: 7.7×5.5
Boards: 507

TSOT-23-5

FP3D

Package_TO_SOT_SMD

TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)

Pads: 5
SMD: 4.1×3.4
Boards: 256

USB_Micro-AB_Molex_47590-0001

FP—

Connector_USB

Micro USB AB receptacle, right-angle inverted (https://www.molex.com/pdm_docs/sd/475900001_sd.pdf)

Pads: 6
SMD: 10.4×7.4
Boards: 26

Diode_Bridge_Diotec_ABS

FP3D

Diode_SMD

SMD diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf

Pads: 4
SMD: 7.5×5.5
Boards: 19

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

SSOP-14_5.3x6.2mm_P0.65mm

FP3D

Package_SO

SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)

Pads: 14
SMD: 9.4×6.7
Boards: 14

Crystal_SMD_Abracon_ABS25-4Pin_8.0x3.8mm

FP—

Crystal

Abracon Miniature Ceramic SMD Crystal ABS25 https://abracon.com/Resonators/abs25.pdf, 8.0x3.8mm^2 package

Pads: 4
SMD: 6.1×9.0
Boards: 8

PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)

Pads: 44
SMD: 14.5×14.5
Boards: 7

CERDIP-14_W7.62mm_SideBrazed

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 9.7×19.6
Boards: 2

CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.7×19.7
Boards: 2

SODIMM-200_1.8V_Card_edge

FP—

Connector_PCBEdge

SODIMM 200-pins edge connector, Jedec MO-224 Variation AB compliant (1.8V DDR2 SDRAM), 0.6mm pitch, https://www.jst-mfg.com/product/pdf/eng/eDM-200P.pdf

Pads: 200
Mount: 68.6×27.9
Boards: 1

ST_D_SMC

FP3D

Diode_SMD

STMicroelectronics SMC (JEDEC DO-214-D, variant AB), https://www.st.com/resource/en/datasheet/sm15t36a.pdf#page=7

Pads: 2
SMD: 8.8×6.4
Boards: 1

Oscillator_SMD_Silicon_Labs_LGA-6_2.5x3.2mm_P1.25mm

FP—

Oscillator

Silicon_Labs LGA, 6 Pin (https://www.silabs.com/documents/public/data-sheets/si512-13.pdf)

Pads: 6
SMD: 3.0×3.7
Boards: 1

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 1

CERDIP-14_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.5×19.6
Boards: 1