Footprints

31 footprints matching “DIP-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

31 footprints · page 1 of 2

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DIP-8_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×10.7
Boards: 956

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

DIP-8_W10.16mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 8
THT: 12.3×10.7
Boards: 17

DIP-8_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 8
SMD: 10.7×10.8
Boards: 14

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

DIP-8-N7_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7

Pads: 7
THT: 9.8×10.7
Boards: 3

DIP-8-16_W7.62mm

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×20.8
Boards: 2

DIP-8_W7.62mm

FP—

digikey-digikey-footprints

http://media.digikey.com/pdf/Data%20Sheets/Lite-On%20PDFs/6N137%20Series.pdf

Pads: 8
THT: 9.7×10.2
Boards: —

DIP-8_W7.62mm

FP—

digikey-Source_Footprints

http://media.digikey.com/pdf/Data%20Sheets/Lite-On%20PDFs/6N137%20Series.pdf

Pads: 8
THT: 9.7×10.2
Boards: —

DIP-8-16_W7.62mm_Socket

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-16_W7.62mm_Socket_LongPads

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads: 7
THT: 9.8×10.7
Boards: —

Oscillator_DIP-8

FP3D

Oscillator

Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 120

SMDIP-8_W9.53mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 8
SMD: 12.0×10.7
Boards: 20

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

Oscillator_DIP-8_LargePads

FP3D

Oscillator

Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 4

CERDIP-8_W7.62mm_SideBrazed

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 9.7×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.5×13.7
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 4

CERDIP-8_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 3

SMDIP-8_W11.48mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 8
SMD: 14.0×10.7
Boards: 2