Footprints
5 footprints matching “HVSON”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
HVSON-8-1EP_4x4mm_P0.8mm_EP2.2x3.1mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf (page 57))
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 3
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
DFN-8-1EP_3x3mm_P0.65mm_EP1.2x2.15mm
Package_DFN_QFN
DFN, 8 Pin (https://www.lcsc.com/datasheet/C5382538.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
DFN-8-1EP_3x3mm_P0.65mm_EP1.2x2.15mm_ThermalVias
Package_DFN_QFN
DFN, 8 Pin (https://www.lcsc.com/datasheet/C5382538.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —