Footprints
18 footprints matching “Integrations”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
TSOC-6_3.76x3.94mm_P1.27mm
Package_SO_J-Lead
Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF
- Pads
- 6
- SMD
- 4.9×4.4
- Boards
- 5
PowerIntegrations_SMD-8
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 8
- SMD
- 11.1×10.7
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
LED_SK6812MINI-E_3.2x2.8mm_P1.5mm_ReverseMount
LED_SMD
RGB LED with integrated controller (https://www.lcsc.com/datasheet/C5149201.pdf)
- Pads
- 4
- SMD
- 7.3×3.7
- Boards
- 1
CR12202
kiml-00-kiml-battery
CR1220-2-3
- Pads
- 2
- THT
- 20.4×16.5
- Boards
- —
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
PowerIntegrations_eSIP-7C
Package_SIP
eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 6
- THT
- 10.5×5.8
- Boards
- —
PowerIntegrations_eSIP-7F
Package_SIP
eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf
- Pads
- 6
- THT
- 14.0×10.7
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —
PowerIntegrations_TO-220-7C
Package_TO_SOT_THT
Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf
- Pads
- 6
- THT
- 11.1×9.7
- Boards
- —
BM78SPPS5xC2
RF_Module
Bluetooth Dual-mode module with integral chip antenna (http://ww1.microchip.com/downloads/en/DeviceDoc/60001380C.pdf)
- Pads
- 33
- SMD
- 13.5×23.0
- Boards
- —