Footprints
6 footprints matching “LFPAK”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFPAK56
Package_TO_SOT_SMD
LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf
- Pads
- 5
- SMD
- 7.3×5.5
- Boards
- 22
LFPAK33
Package_TO_SOT_SMD
LFPAK33 SOT-1210 https://assets.nexperia.com/documents/outline-drawing/SOT1210.pdf
- Pads
- 5
- SMD
- 4.4×3.8
- Boards
- 15
LFPAK88
Package_TO_SOT_SMD
LFPAK88 PowerPAK 8 x 8L BWL Single SOT-1235 (https://assets.nexperia.com/documents/package-information/SOT1235.pdf)
- Pads
- 5
- SMD
- 9.3×9.1
- Boards
- 1
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
NXP LFPAK56 SOT669
celestial-altium-Leaded_Misc
- Pads
- 5
- SMD
- 7.4×5.2
- Boards
- —
NEXPERIA LFPAK33 SOT1210
celestial-altium-Leadless_LFPAK
- Pads
- 3
- SMD
- 3.8×4.4
- Boards
- —
