Footprints
5 footprints matching “PowerFLAT”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerFLAT-5x6
agg-agg
- Pads
- 6
- SMD
- 5.9×7.1
- Boards
- —
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
ST_PowerFLAT-6L_5x6mm_P1.27mm
Package_SON
Thermally-enhanced 5x6mm 6-pin package, https://www.st.com/resource/en/datasheet/stl40dn3llh5.pdf
- Pads
- 6
- SMD
- 7.1×5.9
- Boards
- 1
ST_PowerFLAT_HV-5_8x8mm
Package_SON
High-Voltage 5-pin package, https://www.st.com/resource/en/datasheet/sctl35n65g2v.pdf
- Pads
- 5
- SMD
- 8.9×8.1
- Boards
- —
ST_PowerFLAT_HV-8_5x6mm
Package_SON
High-Voltage 8-pin package, https://www.st.com/resource/en/datasheet/sgt65r65al.pdf
- Pads
- 8
- SMD
- 7.0×5.9
- Boards
- —
