Footprints
8 footprints matching “Renesas”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Renesas_DFN-6_1.5x1.6mm_P0.5mm
OptoDevice
DFN, 6 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-hodfn-6pin-l615x16?language=en&r=568376)
- Pads
- 6
- SMD
- 2.5×2.1
- Boards
- —
Renesas_UQFN-16_2x2mm_P0.4mm
Package_DFN_QFN
Renesas UQFN, 16 Pin (Renesas STQFN-16L, https://www.renesas.com/en/document/dst/slg47011-datasheet#page=228)
- Pads
- 16
- SMD
- 2.8×2.8
- Boards
- —
Renesas_UQFN-20_2x3mm_P0.4mm_LayoutBorder4x6y
Package_DFN_QFN
Renesas UQFN, 20 Pin (Renesas STQFN-20L, https://www.renesas.com/en/document/dst/slg465808283-datasheet#page=200)
- Pads
- 20
- SMD
- 3.2×4.2
- Boards
- —
Renesas_SOP-32_11.4x20.75mm_P1.27mm
Package_SO
Renesas SOP, 32 Pin (https://www.renesas.com/en/document/psc/package-drawing-sop-32pin-prsp0032df)
- Pads
- 32
- SMD
- 15.6×21.3
- Boards
- —
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm
Package_CSP
Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet
- Pads
- 34
- SMD
- 6.5×3.7
- Boards
- —